Patents by Inventor Chang Hak Choi
Chang Hak Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12033805Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).Type: GrantFiled: October 19, 2022Date of Patent: July 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ho Park, Jae Seok Yi, Moon Soo Park, Chang Hak Choi
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Patent number: 12020866Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax) (Ti1-y(Zr, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.Type: GrantFiled: January 14, 2022Date of Patent: June 25, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Ryul Lee, Jong Suk Jeong, Chang Hak Choi
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Publication number: 20240186070Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: ApplicationFiled: February 13, 2024Publication date: June 6, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
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Publication number: 20240128022Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.Type: ApplicationFiled: December 6, 2023Publication date: April 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
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Patent number: 11935703Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: GrantFiled: January 9, 2023Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
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Publication number: 20240071690Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100?Cc2/Cc1?10,000.Type: ApplicationFiled: August 14, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop KIM, Jin Il KANG, Ji Hun LEE, Chang Hak CHOI
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Patent number: 11894196Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.Type: GrantFiled: June 6, 2022Date of Patent: February 6, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Young Soo Yi, Kun Ho Koo, Soung Jin Kim, Ho Yeol Lee, Kyung Ryul Lee, Chang Hak Choi
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Patent number: 11887786Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.Type: GrantFiled: May 10, 2022Date of Patent: January 30, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
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Patent number: 11848415Abstract: An all-solid-state battery includes a body including a solid electrolyte layer, and an anode layer and a cathode layer alternately stacked with the solid electrolyte layer interposed therebetween. A first external electrode is disposed on one side of the body and includes a first electrode layer and a first conductive resin layer disposed on the first electrode layer, and a second external electrode is disposed on another side of the body and includes a second electrode layer and a second conductive resin layer disposed on the second electrode layer. A protective layer is disposed on an entirety of an external surface of the body free of the first and second electrode layers and on the first and second electrode layers, and at least one opening is included in a region of the protective layer disposed on at least one of the first electrode layer and the second electrode layer.Type: GrantFiled: August 12, 2022Date of Patent: December 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Ryul Jung, Kyung Lock Kim, Jong Sik Yoon, Chang Hak Choi, Byeong Cheol Moon
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Publication number: 20230402229Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: ApplicationFiled: August 30, 2023Publication date: December 14, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Publication number: 20230386749Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).Type: ApplicationFiled: October 19, 2022Publication date: November 30, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ho PARK, Jae Seok YI, Moon Soo PARK, Chang Hak CHOI
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Patent number: 11804327Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.Type: GrantFiled: December 16, 2021Date of Patent: October 31, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoon Hee Lee, Bon Seok Koo, Yeon Tae Kim, Chang Hak Choi, Jung Min Kim
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Publication number: 20230343514Abstract: A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt% or more and 0.35 wt% or less with respect to a total content of the Cu particles.Type: ApplicationFiled: December 1, 2022Publication date: October 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Ho KOO, San KYEONG, Soung Jin KIM, Young Soo YI, Ho Yeol LEE, Ic Seob KIM, Kyung Ryul LEE, Chang Hak CHOI
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Publication number: 20230343517Abstract: A dielectric ceramic composition includes a base material main component of barium titanate and a subcomponent. A microstructure of the dielectric ceramic composition after sintering includes a first grain having a Ca content of less than 3.5 at % and a second grain having a Ca content of 3.5 to 13.5 at %, and an area ratio of the second grain to an area of the total grains is 70% to 95%.Type: ApplicationFiled: June 27, 2023Publication date: October 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok Hyun YOON, Chan Hee NAM, Song Je JEON, Chang Hak CHOI
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Patent number: 11798747Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.Type: GrantFiled: October 24, 2022Date of Patent: October 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
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Publication number: 20230326673Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and external electrodes disposed on the body and connected to the internal electrodes. The one of the internal electrodes includes Ni, Ba, Ti, O, and Tb, and a content of Tb relative to a sum of contents of Ni, Ba, Ti, O, and Tb is 0.45 to 3.0 wt %.Type: ApplicationFiled: June 15, 2023Publication date: October 12, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Jung CHO, Byung Kun KIM, Yu Hong OH, Chang Hak CHOI
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Patent number: 11784005Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: GrantFiled: June 9, 2022Date of Patent: October 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Patent number: 11735364Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.Type: GrantFiled: October 27, 2021Date of Patent: August 22, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
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Patent number: 11728094Abstract: A dielectric ceramic composition includes a base material main component of barium titanate and a subcomponent. A microstructure of the dielectric ceramic composition after sintering includes a first grain having a Ca content of less than 3.5 at % and a second grain having a Ca content of 3.5 to 13.5 at %, and an area ratio of the second grain to an area of the total grains is 70% to 95%.Type: GrantFiled: March 11, 2022Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok Hyun Yoon, Chan Hee Nam, Song Je Jeon, Chang Hak Choi
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Patent number: 11715595Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and external electrodes disposed on the body and connected to the internal electrodes. The one of the internal electrodes includes Ni, Ba, Ti, O, and Tb, and a content of Tb relative to a sum of contents of Ni, Ba, Ti, O, and Tb is 0.45 to 3.0 wt %.Type: GrantFiled: July 19, 2021Date of Patent: August 1, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Jung Cho, Byung Kun Kim, Yu Hong Oh, Chang Hak Choi