Patents by Inventor Chang Han Je
Chang Han Je has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8603848Abstract: Provided are a three-dimensional (3D) MEMS structure and a method of manufacturing the same. The method of manufacturing the 3D MEMS structure having a floating structure includes depositing a first etch mask on a substrate, etching at least two regions of the first etch mask to expose the substrate, and forming at least one step in the etched region, partially etching the exposed region of the substrate using the first etch mask, and forming at least two grooves, depositing a second etch mask on a sidewall of the groove, and performing an etching process to connect lower regions of the at least two grooves to each other, and forming at least one floating structure.Type: GrantFiled: August 10, 2010Date of Patent: December 10, 2013Assignee: Electronics and Telecommunications Research InstituteInventor: Chang Han Je
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Patent number: 8544326Abstract: Provided is a vertical accelerometer for measuring acceleration applied perpendicular to a substrate to increase sensitivity thereof. The vertical accelerometer includes a substrate, and a plurality of unit vertical accelerometers, each having a detection mass disposed on the substrate to be rotated by acceleration applied perpendicular to the substrate, and a detection electrode formed at the detection mass. Here, the unit vertical accelerometers are provided to be in contact with the detection electrodes to detect the acceleration through variation in capacitance due to variation in area in which the contacted detection electrodes overlaps each other.Type: GrantFiled: May 20, 2010Date of Patent: October 1, 2013Assignee: Electronics and Telecommunications Research InstituteInventor: Chang Han Je
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Publication number: 20130100779Abstract: A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.Type: ApplicationFiled: July 24, 2012Publication date: April 25, 2013Applicant: Electronics & Telecommunications Research InstituteInventors: Jae Woo LEE, Chang Han Je, Woo Seok Yang, Jong Dae Kim
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Publication number: 20130094675Abstract: Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.Type: ApplicationFiled: August 31, 2012Publication date: April 18, 2013Applicant: Electronics and Telecommunications Research InstituteInventors: Chang Han Je, Jaewoo Lee, Woo Seok Yang, Jongdae Kim
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Patent number: 8415717Abstract: Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.Type: GrantFiled: January 24, 2011Date of Patent: April 9, 2013Assignee: Electronics and Telecommunications Research InstituteInventors: Jaewoo Lee, Chang Han Je, Woo Seok Yang, Jongdae Kim
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Patent number: 8359758Abstract: A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.Type: GrantFiled: April 15, 2008Date of Patent: January 29, 2013Assignee: Electronics and Telecommunications Research InstituteInventors: Sung Sik Lee, Myung Lae Lee, Chang Han Je, Gunn Hwang, Chang Auck Choi
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Patent number: 8319397Abstract: Provided is a small piezoelectric power generator applied to a wireless sensor network system of a tire pressure monitoring system (TPMS) for monitoring an internal environment of a tire such as variation in air pressure in the tire. In particular, when the system, in which air pressure, temperature and acceleration sensors are mounted, installed in the tire is operated in the TPMS for an automobile, a small piezoelectric power generator for the TPMS can be used as a power source in place of a conventional battery. The piezoelectric power generator includes a substrate having an electrode for transmitting power to the exterior, a metal plate formed on the substrate, and a piezoelectric body disposed on the metal plate and transmitting the power generated by a piezoelectric material to the electrode.Type: GrantFiled: August 24, 2010Date of Patent: November 27, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Choon Ko, Chang Han Je, Ho Jun Ryu, Sung Sik Lee, Chi Hoon Jun
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Patent number: 8261617Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.Type: GrantFiled: April 21, 2008Date of Patent: September 11, 2012Assignee: Electronics and Telecomunications Research InstituteInventors: Chang Auck Choi, Chang Han Je, Gunn Hwang, Youn Tae Kim, Sung Hae Jung, Myung Lae Lee, Sung Sik Lee, Seok Hwan Moon
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Publication number: 20120139066Abstract: Disclosed is a micro electro mechanical system (MEMS) microphone including: a substrate; an acoustic chamber formed by processing the substrate; a lower electrode formed on the acoustic chamber and fixed to the substrate; a diaphragm formed over the lower electrode so as to be spaced apart from the lower electrode by a predetermined interval; and a diaphragm discharge hole formed at a central portion of the diaphragm. According to an exemplary embodiment of the present disclosure, attenuation generated by an air layer between the diaphragm and the lower electrode in a MEMS microphone may be effectively reduced, thereby making it possible to obtain high sensitivity characteristics and reduce a time and a cost required for removing a sacrificial layer between the diaphragm and the lower electrode.Type: ApplicationFiled: October 4, 2011Publication date: June 7, 2012Applicant: Electronics and telecommunications Research InstituteInventors: Chang Han JE, Jaewoo Lee, Woo Seok Yang, Jongdae Kim
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Publication number: 20120098076Abstract: Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.Type: ApplicationFiled: January 24, 2011Publication date: April 26, 2012Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Jaewoo LEE, Chang Han Je, Woo Seok Yang, Jongdae Kim
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Patent number: 8113054Abstract: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.Type: GrantFiled: December 5, 2007Date of Patent: February 14, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Chang-Han Je, Gunn Hwang, Sung-Hae Jung, Myung-Lae Lee, Chang-Auck Choi
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Patent number: 8035176Abstract: Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.Type: GrantFiled: July 25, 2007Date of Patent: October 11, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Sung-Hae Jung, Myung-Lae Lee, Gunn Hwang, Chang-Kyu Kim, Chang-Han Je, Chang-Auck Choi
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Patent number: 7997137Abstract: There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors.Type: GrantFiled: July 3, 2008Date of Patent: August 16, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Sung Sik Lee, Ji Man Park, Myung Lae Lee, Sung Hae Jung, Chang Han Je, Gunn Hwang, Chang Auck Choi
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Publication number: 20110192040Abstract: A three-dimensional inclination angle calculation circuit is provided. The three-dimensional inclination angle calculation circuit includes: X-axis, Y-axis, and Z-axis vibration sensors which change X-axis, Y-axis, and Z-axis electrostatic capacitances according to three-dimensional positions of a measured plane with respect to a reference plane, respectively; X-axis, Y-axis, and Z-axis position value acquisition units which acquire X-axis, Y-axis, and Z-axis position values corresponding to the X-axis, Y-axis, and Z-axis electrostatic capacitances, respectively; and an inclination angle calculation unit which calculates an inclination angle of the measured plane with respect to the reference plane based on the X-axis, Y-axis, and Z-axis position values. Accordingly, it is possible to very easily calculate an inclination angle according to a three-dimensional position of a to-be-measured apparatus by using an existing vibration sensor.Type: ApplicationFiled: April 15, 2008Publication date: August 11, 2011Inventors: Sung Sik Lee, Myung Lae Lee, Chang Han Je, Gunn Hwang, Chang Auck Choi
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Publication number: 20110186089Abstract: An apparatus for preventing stiction of a three-dimensional MEMS (microelectromechanical system) microstructure, the apparatus including: a substrate; and a plurality of micro projections formed on a top surface of the substrate with a predetermined height in such a way that a cleaning solution flowing out from the microstructure disposed thereabove is discharged.Type: ApplicationFiled: April 14, 2008Publication date: August 4, 2011Inventors: Chang Han Je, Myung Lae Lee, Sung Hae Jung, Gunn Hwang, Chang Auck Choi
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Patent number: 7975550Abstract: There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field.Type: GrantFiled: April 29, 2008Date of Patent: July 12, 2011Assignee: Electronics and Telecommunications Research InstituteInventors: Myung Lae Lee, Chang Han Je, Sung Sik Lee, Sung Hae Jung, Chang Auck Choi, Gunn Hwang
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Publication number: 20110138913Abstract: Provided is a vertical accelerometer for measuring acceleration applied perpendicular to a substrate to increase sensitivity thereof. The vertical accelerometer includes a substrate, and a plurality of unit vertical accelerometers, each having a detection mass disposed on the substrate to be rotated by acceleration applied perpendicular to the substrate, and a detection electrode formed at the detection mass. Here, the unit vertical accelerometers are provided to be in contact with the detection electrodes to detect the acceleration through variation in capacitance due to variation in area in which the contacted detection electrodes overlaps each other.Type: ApplicationFiled: May 20, 2010Publication date: June 16, 2011Applicant: Electronics and Telecommunications Research InstituteInventor: Chang Han JE
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Publication number: 20110140578Abstract: Provided is a small piezoelectric power generator applied to a wireless sensor network system of a tire pressure monitoring system (TPMS) for monitoring an internal environment of a tire such as variation in air pressure in the tire. In particular, when the system, in which air pressure, temperature and acceleration sensors are mounted, installed in the tire is operated in the TPMS for an automobile, a small piezoelectric power generator for the TPMS can be used as a power source in place of a conventional battery. The piezoelectric power generator includes a substrate having an electrode for transmitting power to the exterior, a metal plate formed on the substrate, and a piezoelectric body disposed on the metal plate and transmitting the power generated by a piezoelectric material to the electrode.Type: ApplicationFiled: August 24, 2010Publication date: June 16, 2011Applicant: Electronics and Telecommunications Research InstituteInventors: Sang Choon Ko, Chang Han Je, Ho Jun Ryu, Sung Sik Lee, Chi Hoon Jun
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Publication number: 20110049651Abstract: Provided are a three-dimensional (3D) MEMS structure and a method of manufacturing the same. The method of manufacturing the 3D MEMS structure having a floating structure includes depositing a first etch mask on a substrate, etching at least two regions of the first etch mask to expose the substrate, and forming at least one step in the etched region, partially etching the exposed region of the substrate using the first etch mask, and forming at least two grooves, depositing a second etch mask on a sidewall of the groove, and performing an etching process to connect lower regions of the at least two grooves to each other, and forming at least one floating structure.Type: ApplicationFiled: August 10, 2010Publication date: March 3, 2011Applicant: Electronics and Telecommunications Research InstituteInventor: Chang Han JE
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Publication number: 20100251826Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.Type: ApplicationFiled: April 21, 2008Publication date: October 7, 2010Inventors: Chang Auck Choi, Chang Han Je, Gunn Hwang, Youn Tae Kim, Sung Hae Jung, Myung Lae Lee, Sung Sik Lee, Seok Hwan Moon