Abstract: A method for manufacturing a semiconductor device includes forming a metal layer in a substrate and sequentially forming a barrier layer and an insulating layer on the substrate. The method includes performing a first etching step to form an opening in the insulating layer, and the opening does not expose the barrier layer. After the first etching step, a gap-filling layer is formed on the insulating layer and fills the opening. The method includes performing a second etching step to form a first via communicating with the opening in the gap-filling layer, and an upper portion of the opening is widened to form a trench. The method includes performing a third etching step to remove the gap-filling layer in a bottom of the opening and to deepen both the trench and the opening. The method includes forming a second via communicating with the opening to expose the metal layer.

Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: Method, apparatus and computer program product manage a plurality of networks with a single tenant network management tool using virtualization and implement control plane virtualization of the single tenant management tool; data storage virtualization of a data storage apparatus and network address virtualization of an available address range. A virtual machine may be implemented for each network of the plurality of networks to contain an instance of the single tenant management tool. In one implementation, a proxy is used to implement data storage virtualization. In another implementation, separate data storage is maintained for each network and data storage virtualization is achieved by managing the network protocol stack virtualization. The network address virtualization may be implemented using machine-level virtualization or operating-system-level virtualization.

Abstract: Method, apparatus and computer program product manage a plurality of networks with a single tenant network management tool using virtualization and implement control plane virtualization of the single tenant management tool; data storage virtualization of a data storage apparatus and network address virtualization of an available address range. A virtual machine may be implemented for each network of the plurality of networks to contain an instance of the single tenant management tool. In one implementation, a proxy is used to implement data storage virtualization. In another implementation, separate data storage is maintained for each network and data storage virtualization is achieved by managing the network protocol stack virtualization. The network address virtualization may be implemented using machine-level virtualization or operating-system-level virtualization.