Abstract: A cutting insert has a top surface and a bottom surface having a parallelogram shape, and four side surfaces connecting the top and bottom surfaces. One or more primary cutting edges are formed at intersections between the top and bottom surfaces and two opposing side surfaces. Secondary cutting edges are formed at intersections between the top and bottom surfaces and two other opposing side surfaces. The primary cutting edge forms a first angle with respect to a median plane parallel to the top and bottom surfaces. The secondary cutting edge forms a second angle with respect to the median plane. The top and bottom surfaces have a mounting surface and a rack surface, wherein the rack surface extends inwardly from the cutting edge toward the median plane. The top and bottom surfaces of the cutting insert have mirror symmetry with respect to the median plane.

Abstract: A cutting tool for machining metallic materials has at least one cutting portion having a cartridge and a cartridge pocket for mounting cutting inserts to the cutting tool. The cartridge pocket has a top surface, a rear supporting surface and a bottom supporting surface. The top surface of the cartridge pocket has one or more serrated projecting portions. The cartridge has an insert pocket, a top surface, a first side surface and a bottom surface. The insert pocket of the cartridge receives a cutting insert. The top surface of the cartridge has one or more outwardly sloped surfaces and one or more inwardly sloped surfaces. The outwardly sloped surfaces mate with the serrated projecting portions. The inwardly sloped surfaces have a gap with respect to the projecting portions of the cartridge pocket.

Abstract: A cutting insert of the present invention has a body, auxiliary cutting edges of a convex curve shape and main cutting edges. The body has a top surface, a bottom surface, side surfaces connecting the top and bottom surfaces, and corner surfaces connecting the adjacent side surfaces. The auxiliary cutting edges are formed at intersections between the top and bottom surfaces and the side surfaces. The main cutting edges are formed at intersections between the top and bottom surfaces and the corner surfaces. The main cutting edge in the top surface extends from an end of an adjacent auxiliary cutting edge to its center in a direction toward the bottom surface and from the center to an end of another adjacent auxiliary cutting edge in a direction away from the bottom surface.

Abstract: The present invention provides a cutting insert and a cutting tool used with the same. A tool body includes at least one seating surface and a threaded hole extending as slanted with respect to the seating surface. At least one cutting insert having a mounting hole passing therethrough is removably secured on the seating surface. A screw passes through the mounting hole and is fastened to the threaded hole, thereby removably securing the cutting insert to the tool body. A wall surface of the mounting hole contacts a head of the screw about at least one first contact portion and at least one second contact portion. The first contact portion is formed at a level different from that of the second contact portion along a longitudinal axis of the mounting hole. Contact angles at the first contact portions and the second contact portions are different from each other.

Abstract: A roll coupled to a separately manufactured axle rotates together with the axle in order to perform a rolling process. The roll includes an inner cylindrical surface, an outer cylindrical surface and both side faces, and at least one key way provided on at least one of the side faces is arranged adjacent to the inner cylindrical surface rather than said outer cylindrical surface, The key way is in a concave curved shape and is a portion of a spherical surface or of an ellipsoidal surface.

Abstract: A double-sided milling cutting insert has usable upper and lower faces. The upper face has a polygonal shape with curved edges. The lower face has a rotationally symmetrical relation to the upper face. Flank faces connect edges of the upper face to corresponding edges of the lower face. Upper cutting edges are formed on one of the edges of the upper face. The upper chip-forming portions have rake faces inclined downwardly from the upper cutting edges inwardly of the cutting insert and a plurality of protrusions arranged along inner boundaries of the rake faces for deflecting chips. When the cutting insert is mounted on the cutting tool, a width of the rake face of the upper chip-forming portion adjacent to an edge portion forming a main cutting edge gradually increases in a direction going away from a rotational axis of the cutting tool.

Abstract: The present invention is directed to a cutting tool, comprising: at least one cutting insert; a tool body including a pocket portion to which the cutting insert is mounted; a means for fixing the cutting insert to the pocket portion of the tool body; and a screw for finely adjusting the position of the cutting insert fixed to the pocket portion of the tool body. The screw has a head portion, a threaded portion and a portion for connecting the head portion to the threaded portion. The pocket portion has a bottom surface with a screw hole formed thereon into which the threaded portion is fastened. It also has a side wall comprising a surface for closely contacting the head portion of the screw. The head portion of the screw closely contacts and resiliently pressurizes the close contact surface of the pocket portion when the threaded portion is fastened into the screw hole.

Abstract: Tool holder assembly (TH) for multifunctional machining, such as drilling, boring, facing, and turning, eliminate interference between facing and turning, and secure an adequate chip groove space (10) for discharging chips therethrough without deterioration of a rigidity of the tool holder (TH), thereby securing a good quality of machining, and an exclusive adapter (TA) suitable to the foregoing tool holder (TH) assembly for multifunctional machining.

Abstract: A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.

Abstract: An electrical device including a PTC conductive polymer sheet, and first and second electrodes physically contacted with opposite surfaces of the conductive polymer sheet is disclosed. The first and second electrodes have a plurality of protrusions protruded from surfaces thereof, respectively. The protrusions have an surface roughness (Rz) of 1 to 20 ?m and an average width ({overscore (Rw)}) which is 0.5 to 2 times of the surface roughness (Rz), and an average gap ({overscore (Rg)}) between adjacent protrusions is 0.5 and 2 times of the surface roughness (Rz). The conductive polymer sheet has a thickness which is more than 5 times of the surface roughness (Rz).

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm2 to about 20 A/dm2.

Abstract: A surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards is provided. The method includes nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon, and coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.

Abstract: An electrical device including a PTC conductive polymer sheet, and first and second electrodes physically contacted with opposite surfaces of the conductive polymer sheet is disclosed. The first and second electrodes have a plurality of protrusions protruded from surfaces thereof, respectively. The protrusions have an surface roughness (Rz) of 1 to 20 &mgr;m and an average width ({overscore (Rw)}) which is 0.5 to 2 times of the surface roughness (Rz), and an average gap ({overscore (Rg)}) between adjacent protrusions is 0.5 and 2 times of the surface roughness (Rz). The conductive polymer sheet has a thickness which is more than 5 times of the surface roughness (Rz).

Abstract: A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.

Abstract: The present invention relates to a method for manufacturing a low roughness electrodeposited copper foil, and an electrodeposited copper foil manufactured thereby, and uses an electrolyte which basically consists of a sulfuric acid, a copper ion and a chloride ion is adapted with an additive which consists of a HEC (Hydroxyethyl Cellulose) of 0.05˜50 ppm, a SPS (bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm, and a gelatin of 0.1˜100 ppm. The present invention is adapted to manufacture a low roughness electrodeposited copper foil using a conventional copper foil manufacture facility and the electrodeposited copper foil according to the present invention is adapted as a material for a copper clad laminate for a printed circuit substrate and an electrode material for a lithium ion battery.

Abstract: The present invention discloses a method of producing a copper foil used for a printed circuit board (PCB). In this method of producing a copper foil for a solder bump, metal surfaces are activated by plasma or primer treatment and finally are clad using a pressing means in a process of cladding a copper foil constituting a bump and a copper foil forming a circuit. Therefore, it is possible to produce a copper foil for a PCB with excellent adhesion strength without carrying out any bump forming process.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for printed circuit boards, comprises a barrier layer formed of ternary alloy of Zn—Co—As on the copper foil. According to another aspect of the invention a surface treatment method of an electrodeposited copper foil for printed circuit boards is performed comprises the steps of electrolytically treating the copper foil in the electrolytic solution containing pyrophosphoric acid potassium of 10˜200 g/l, Zn of 0.1˜20 g/l, Co of 0.1˜20 g/l and As of 0.05˜5 g/l. Further, the electrolytic solution remains at the temperature of 20˜50° C. and pH=9˜13, and the copper foil is electrolytically treated for 2˜20 seconds at the cathode current density of 0.5˜20 A/dm2.

Abstract: Disclosed is a surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards, which includes the steps of nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon and then coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.

Abstract: An electrical device having PTC conductive polymer is made by combining electrodes, in which electroless nickel plating is formed on an electrolytic copper foil, with PTC conductive polymer. The electrodes have electroless-plated nickel layers at both sides of an electrolytic copper foil and the PTC conductive polymer is welded between the electrodes in a sandwich type.

Abstract: Finishing throwaway ball endmill has a blade tip adapted to make a firm attachment to a body thereof with easy.