Patents by Inventor Chang Hoon BYEON

Chang Hoon BYEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993056
    Abstract: The present invention provides a metal-plastic composite material having excellent adhesive strength and formability and a method for manufacturing the same, and specifically, the present invention provides a metal-plastic composite material and a method for manufacturing the same comprising: a metal layer; and a plastic layer on at least one surface of the metal layer, wherein a thin film layer formed of a silane coupling agent is provided between the metal layer and the plastic layer, and the metal layer and the plastic layer are bonded by covalent bonding with the silane coupling agent.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: May 28, 2024
    Assignee: POSCO
    Inventors: Hye-Jin Yoo, Chang-Se Byeon, Jung-Su Kim, Je-Hoon Baek, Hwi-Geon Kim
  • Publication number: 20240152154
    Abstract: Disclosed is a method of controlling a server for managing movement schedules of a plurality of robots. The control method includes receiving an occupancy request for at least one node matching a scheduled moving route from at least one of the plurality of robots; setting actually occupied nodes and provisionally occupied nodes of each of the plurality of robots based on the occupancy request; and transmitting occupancy permission information including the set actually occupied node and provisionally occupied node to each of the plurality of robots. In the setting of the actually occupied node and the provisionally occupied node, the actually occupied nodes and the provisionally occupied nodes of each of the plurality of robots are selected so that an actually occupied node of one robot does not overlap an actually occupied node or a provisionally occupied node of another robot.
    Type: Application
    Filed: December 19, 2022
    Publication date: May 9, 2024
    Applicant: Twinny Co., Ltd.
    Inventors: Young Jin BYEON, Sang Su LEE, Jae Yeong AN, Dong Woo SEO, Chang Hoon LEE
  • Publication number: 20240120007
    Abstract: A semiconductor memory device may include a cell substrate; a mold structure including a plurality of gate electrodes stacked on the cell substrate; a channel structure penetrating the mold structure; a string select line on the mold structure; a string select channel structure penetrating the string select line and contacting the channel structure; an anti-arcing contact penetrating the mold structure; an insulating pattern between the anti-arcing contact and the plurality of gate electrodes; and an anti-arcing insulating pattern penetrating the string select line to be in contact with the anti-arcing contact.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Chul Min CHOI, Chang Hoon BYEON, Sun Il SHIM