Patents by Inventor Chang-Hoon Han

Chang-Hoon Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip stack package having dummy chip
    Publication number: 20060151865
    Abstract: A chip stack package may have a circuit substrate, a first IC chip provided on the circuit substrate, and a second IC chip provided on the first IC chip. The second IC chip may be larger in size than the first IC chip and have overhang portions that may extend beyond edges of the first IC chip. At least one dummy chip may be provided on the second IC chip and cover the edges of the first IC chip. The dummy chip may include a single chip or a plurality of chips.
    Type: Application
    Filed: December 9, 2005
    Publication date: July 13, 2006
    Inventors: Chang-Hoon Han, Sang-Ho An