Patents by Inventor Chang Hoon Ko

Chang Hoon Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solution composition for surface treatment of steel sheet and surface-treated steel sheet using same
    Patent number: 11939489
    Abstract: Provided is a composition for surface treatment of a steel sheet, the composition having excellent resistance to an acid, such as sulfuric acid, and to a coated steel sheet to which the composition for surface treatment is applied, wherein the composition for surface treatment comprises 30-50% wt % of colloidal silica containing 5-20 nm-sized silica, 40-60% wt % of silane containing three or more alkoxy groups, 5-15 wt % of an acrylate-based organic monomer, 0.01-1 wt % of an acid, and 1-15 wt % of a solvent.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: March 26, 2024
    Assignees: POSCO CO., LTD, NOROO COIL COATINGS CO., LTD.
    Inventors: Chang-Hoon Choi, Dong-Yun Kim, Min-Ho Jo, Jae-Duck Ko, Won-Ho Son, Jong-Hwa Kim
  • DEVICE FOR GENERATING VERIFICATION VECTOR FOR CIRCUIT DESIGN VERIFICATION, CIRCUIT DESIGN SYSTEM, AND REINFORCEMENT LEARNING METHOD OF THE DEVICE AND THE CIRCUIT DESIGN SYSTEM
    Publication number: 20240086603
    Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE
  • Circuit board for semiconductor package
    Patent number: 6469258
    Abstract: A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: October 22, 2002
    Assignees: Amkor Technology, Inc., Amkor Technology Korea, Inc.
    Inventors: Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee, Won Kyun Lee, Tae Hoan Jang, Jun Young Yang