Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.

Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract: A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Abstract: Provided are a light emitting device package and a method of fabricating the same. The package includes a package body including a lead frame, a light emitting device mounted on the package body, a bonding wire configured to electrically connect an electrode formed on a top surface of the light emitting device with the lead frame, a phosphor sheet attached on the light emitting device, and a phosphor molding portion to cover the light emitting device and the phosphor sheet.

Abstract: There is provided a white light emitting device including: a blue LED emitting blue light; a red phosphor excited by the blue light, emitting red light, and including a nitrogen (N)-containing compound; a yellow phosphor excited by the blue light and emitting yellow light; a first green phosphor excited by the blue light, emitting first green light having a first full width half maximum, and including a nitrogen (N)-containing compound; and a second green phosphor excited by the blue light and emitting second green light having a second full width half maximum larger than the first full width half maximum of the first green phosphor.

Abstract: There is provided a light emitting device package using a quantum dot, an illumination apparatus and a display apparatus. The light emitting device package includes a light emitting device; a sealing part disposed in a path of light emitted from the light emitting device and having a lens shape; and a wavelength conversion part sealed within the sealing part and including a quantum dot. The light emitting device package uses the quantum dot as the wavelength conversion part to thereby achieve superior color reproducibility and light emission efficiency, and facilitates the control of color coordinates by adjusting the particle size and concentration of the quantum dot.

Abstract: A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Abstract: A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract: A method of manufacturing a phosphor resin film and a phosphor resin film manufactured thereby are provided. The method of manufacturing a phosphor resin film includes preparing a polymer slurry by mixing a polymer resin and a latent curing agent in a solvent, spreading the polymer slurry such that it has a film shape, drying the spread polymer slurry to form a semi-hardened resin film, and providing phosphor powder to the semi-hardened resin film. A phosphor resin film includes semi-hardened resin film including a polymer resin and a latent curing agent and phosphors uniformly formed on one surface of the semi-hardened resin film.

Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

Abstract: Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

Abstract: There is provided a white light emitting device including: a blue LED emitting blue light; a red phosphor excited by the blue light, emitting red light, and including a nitrogen (N)-containing compound; a yellow phosphor excited by the blue light and emitting yellow light; a first green phosphor excited by the blue light, emitting first green light having a first full width half maximum, and including a nitrogen (N)-containing compound; and a second green phosphor excited by the blue light and emitting second green light having a second full width half maximum larger than the first full width half maximum of the first green phosphor.

Abstract: A light source module using quantum dots, a backlight unit employing the light source module, a display apparatus, and an illumination apparatus. The light source module includes a light emitting device package including a plurality of light emitting device chips, and a quantum dot sealing package disposed on the light emitting device package in a light emitting direction, and converts wavelengths of light emitted from the light emitting device chips to generate wavelength-converted light.

Abstract: A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Abstract: A white light emitting device including: a blue light emitting diode (LED); a green silicate phosphor formed on the blue LED; and a red sulfide phosphor with a surface coated with a silicone oxide layer, the red sulfide phosphor formed on the blue LED.