Patents by Inventor Chang Hsian Yi

Chang Hsian Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite heat conductive structure for a LED package
    Publication number: 20060054914
    Abstract: A composite heat conductive structure for a LED package includes an upper heat conductive base plate substantially made of ceramic material with a hole and a lower heat conductive member with a hollow portion of cylindrical shape on a top surface thereof. The lower heat conductive member is detachably secured to the upper heat conductive base plate by embedding the hollow portion of cylindrical shape in the hole, thereby disposing a light emitting diode on the top surface of the lower heat conductive member within the hollow portion of cylindrical shape.
    Type: Application
    Filed: September 9, 2005
    Publication date: March 16, 2006
    Inventor: Chang Hsian Yi