Abstract: A light-emitting diode (LED) is provided, wherein the LED comprises an epitaxial structure, a bonding layer and a composite substrate. The composite substrate comprises a patterned substrate having a pattern and a conductive material layer disposed around the patterned substrate. The bonding layer is formed on the composite substrate. The epitaxial structure is formed on the bonding layer.

Abstract: A light-emitting diode (LED) is provided, wherein the LED comprises an epitaxial structure, a bonding layer and a composite substrate. The composite substrate comprises a patterned substrate having a pattern and a conductive material layer disposed around the patterned substrate. The bonding layer is formed on the composite substrate. The epitaxial structure is formed on the bonding layer.

Abstract: A light-emitting diode (LED) and a method for manufacturing the same are described. The method for manufacturing the LED comprises the following steps. An illuminant epitaxial structure is provided, in which the illuminant epitaxial structure has a first surface and a second surface on opposite sides, and a substrate is deposed on the first surface of the illuminant epitaxial structure. A metal layer is formed on the second surface of the illuminant epitaxial structure. An anodic oxidization step is performed to oxidize the metal layer, so as to form a metal oxide layer. An etching step is performed to remove a portion of the metal oxide layer, so as to form a plurality of holes in the metal oxide layer.

Abstract: A light-emitting diode and the manufacturing method thereof are provided, wherein the light-emitting diode comprises an epitaxial structure, a bonding layer and a composite substrate. The bonding layer located over one side of the epitaxial structure is used for adhering the composite substrate to the epitaxial structure. The composite substrate comprises a patterned silicon layer penetrated through by a plurality of openssilicon, and a metal layer covering the patterned silicon layer, wherein a portion of the metal layer is filled into the opens and contacts the bonding layer.

Abstract: A light-emitting diode (LED) and a method for manufacturing the same are described. The method for manufacturing the LED comprises the following steps. An illuminant epitaxial structure is provided, in which the illuminant epitaxial structure has a first surface and a second surface on opposite sides, and a substrate is deposed on the first surface of the illuminant epitaxial structure. A metal layer is formed on the second surface of the illuminant epitaxial structure. An anodic oxidization step is performed to oxidize the metal layer, so as to form a metal oxide layer. An etching step is performed to remove a portion of the metal oxide layer, so as to form a plurality of holes in the metal oxide layer.

Abstract: A light-emitting diode and the manufacturing method thereof are provided, wherein the light-emitting diode comprises an epitaxial structure, a bonding layer and a composite substrate. The bonding layer located over one side of the epitaxial structure is used for adhering the composite substrate to the epitaxial structure. The composite substrate comprises a patterned silicon layer penetrated through by a plurality of openssilicon, and a metal layer covering the patterned silicon layer, wherein a portion of the metal layer is filled into the opens and contacts the bonding layer.

Abstract: The micro coaxial connector includes a signal terminal, a main body, and two grounding elements. The signal terminal has a pair of tag-like contact arms and bending arms at a front and rear end thereof, and a strip plane at a middle section thereof. The contact arms are for contacting with a base of a printed circuit board (PCB). The main body is for receiving the signal terminal and serving as an insulation. The two grounding elements are separated designs. The cylindrical-shaped first grounding element is for receiving and fastening the main body, and has a pair of extension arms for providing the coaxial cable with suitable clamping forces. The second grounding element is a cover-like body, and has a strip-like projection for increasing strength against bending of the second grounding element and preventing loosening of components.

Abstract: A micro coaxial cable connecting device, with application to cable to cable inter-connecting of micro coaxial cables, whereby the connecting device is separately configured as a female terminal connector and a male terminal connector, wherein the female terminal connector is assembled to include a signal terminal, an insulator, a conductor and a cover; and the male terminal connector is assembled to include a socket terminal, an insulator base and a casing. Structural design of the male terminal connector and the female terminal connector allows utilizing a lap joint method to connect said two connectors, and thereby enables reduction in production costs of connecting devices, provides enhancement in productivity, and answers to industrial utilization of such.