Abstract: The present invention discloses a structure of package socket and package legs for three-primary-color LED and the manufacturing method of this structure. One of the leg forms a die bonding seat and a common negative bonding pad, the other three legs form positive bonding pads. Said negative and positive bonding pads are arranged in the four corners of a square, with two legs stretch to the right, the other two legs stretch to the left. Then punch by a punch machine with a tooling to form an array of the structures, or by electrode plating or by etching to form the array. The four legs are then bending 90° to one side near the bonding pads such that it can stand alone. After die bond and wire bond has performed, the LED is sealed by transparent epoxy molding, and then cut to single structures, or the structure is cut to single structures before the LED is sealed by transparent epoxy. The other structure is by further bending the four legs near the end of the legs to satisfy surface mount technology (SMT).

Abstract: The present invention discloses a structure of package socket and package legs for three-primary-color LED and the manufacturing method of this structure. One of the leg forms a die bonding seat and a common negative bonding pad, the other three legs form positive bonding pads. Said negative and positive bonding pads are arranged in the four corners of a square, with two legs stretch to the right, the other two legs stretch to the left. Then punch by a punch machine with a tooling to form an array of the structures, or by electrode plating or by etching to form the array. The four legs are then bending 90° to one side near the bonding pads such that it can stand alone. After die bond and wire bond has performed, the LED is sealed by transparent epoxy molding, and then cut to single structures, or the structure is cut to single structures before the LED is sealed by transparent epoxy. The other structure is by further bending the four legs near the end of the legs to satisfy surface mount technology (SMT).

Abstract: The present invention discloses an electrode structure of a light emitted diode and manufacturing method of the electrodes. After formed a pn-junction 2, 3 of a light emitted diode on a substrate 1, a layer of SiO2 is deposited on the periphery of the LED die near the scribe line of the wafer, then a transparent conductive layer 5 is deposited, then a layer of gold or AuGe etc 6, is formed with an opening on the center of the die. After forming alloy with the semiconductor by heat treatment to form ohmic contact, a strip of aluminum (Al) 7 is formed on one side of the die on the front side for wire bonding and to be the positive electrode of the LED. The negative electrode 10 is formed on the substrate by metal contact.

Abstract: The present invention discloses a light source of full color LED (light emitted diode) by using die bond and packaging technology. A first mono-color LED chip with reflective metal on the bottom and transparent metal-oxide on the top of the chip is bonded on the PC board by thermal or ultrasonic die bond. A second mono-color LED chip with reflective metal on both sides is bonded in cascade on the first LED chip by thermal or ultrasonic die bond. The first LED chip emits light through the transparent metal-oxide to mix with the second LED light such that a different color light will obtain. The reflective metal reflects all the light to enforce the light intensity. In near field application, a red, a blue and a green LED are die bond in cascade to get a white light or full color light. In far field application, a yellow and a blue LED are die bond in cascade on the PC board, in its side is another cascaded die bond of a red and a green LED to get a white light or full color light.

Abstract: The present invention discloses a light source of full color LED (light emitted diode) by using die bond and packaging technology. A first mono-color LED chip with reflective metal on the bottom and transparent metal-oxide on the top of the chip is bonded on the PC board by thermal or ultrasonic die bond. A second mono-color LED chip with reflective metal on both sides is bonded in cascade on the first LED chip by thermal or ultrasonic die bond. The first LED chip emits light through the transparent metal-oxide to mix with the second LED light such that a different color light will obtain. The reflective metal reflects all the light to enforce the light intensity. In near field application, a red, a blue and a green LED are die bond in cascade to get a white light or full color light. In far field application, a yellow and a blue LED are die bond in cascade on the PC board, in its side is another cascaded die bond of a red and a green LED to get a white light or full color light.

Abstract: The present invention discloses a package structure containing two LEDs (light emitting diodes), which are packaged in cascade and capable of emitting lights with different wavelengths. For example, by packaging a yellow LED die above a blue LED die or packaging a blue LED die above a yellow LED die, a desaturated blue, desaturated yellow or white light can be obtained when a blue light is emitted through a yellow light or a yellow light is emitted through a blue light. The present invention can be a single-anode-single-cathode or a double-anode-single-cathode package structure, wherein the latter structure can continually change the emitted light in a certain range by adjusting input voltages of the anodes.