Abstract: A backside illuminated image sensor includes pixel regions disposed in a substrate, an anti-reflective layer disposed on a backside surface of the substrate, a light-blocking pattern disposed on the anti-reflective layer and having openings corresponding to the pixel regions, a color filter layer disposed on the light-blocking pattern, and a micro lens array disposed on the color filter layer, wherein the light-blocking pattern has a width decreasing toward the backside surface of the substrate.

Abstract: A backside illuminated image sensor includes pixel regions disposed in a substrate, an insulating layer disposed on a frontside surface of the substrate, a bonding pad disposed on a frontside surface of the insulating layer, and an anti-reflective layer disposed on a backside surface of the substrate. The substrate has a first opening for partially exposing a backside surface of the bonding pad, the insulating layer has a second opening for partially exposing the backside surface of the bonding pad, and the anti-reflective layer has a first portion extending along an inner side surface of the first opening.

Abstract: A backside illuminated image sensor includes pixel regions disposed in a substrate, a light-blocking pattern disposed on a backside surface of the substrate and having openings corresponding to the pixel regions, a color filter layer disposed on the light-blocking pattern, a micro lens array disposed on the color filter layer, and refraction patterns respectively disposed in the openings to condense light passing through the micro lens array and the color filter layer into the pixel regions.

Abstract: Provided are a superabsorbent polymer having a high bulk density value and showing a reduction in unpleasant odors which may be caused by various additives included in a preparation process while basically maintaining excellent absorption performance and absorption rate, and a preparation method thereof.

Abstract: The present invention provides a thermoplastic resin and a molded article using the same, wherein the thermoplastic resin comprises: (A) 10 parts by weight to less than 30 parts by weight of a butadiene-based graft copolymer; (B) 5 parts by weight or more to less than 30 parts by weight of an acrylate-based graft copolymer; (C) 35 parts by weight to 65 parts by weight of a vinyl cyanide-aromatic vinyl-based copolymer; (D) 1 part by weight to 10 parts by weight of an ethylene-alkyl acrylate-based copolymer elastomer based on the total 100 parts by weight of (A), (B), and (C); and (E) 1 part by weight to 10 parts by weight of a polyester-based elastomer.

Abstract: The present invention relates to a backside illuminated CMOS image sensor.

Abstract: A backside illuminated image sensor includes a photodiode arranged in a substrate, a first insulating layer arranged on a front surface of the substrate, a bonding pad arranged on the first insulating layer, and a second insulating layer arranged on the first insulating layer and the bonding pad. The bonding pad is partially exposed by an opening passing through the substrate and the first insulating layer, and an edge portion of the bonding pad is supported by the first and second insulating layers.

Abstract: The present invention relates to a backside illuminated CMOS image sensor.

Abstract: A backside illuminated image sensor includes pixel regions disposed in a substrate, wiring layers disposed on a frontside surface of the substrate and electrically connected with the pixel regions, a color filter layer disposed on a backside surface of the substrate, a micro lens array disposed on the color filter layer, and isolation regions configured to electrically isolate the pixel regions from each other. Each of the isolation regions includes a deep trench isolation region and a shallow trench isolation region disposed on the deep trench isolation region.

Abstract: A backside illuminated image sensor includes pixel regions disposed in a substrate, an anti-reflective layer disposed on a backside surface of the substrate, a light-blocking pattern disposed on the anti-reflective layer and having openings corresponding to the pixel regions, a color filter layer disposed on the light-blocking pattern, and a micro lens array disposed on the color filter layer, wherein the light-blocking pattern has a width decreasing toward the backside surface of the substrate.

Abstract: The present invention relates to method for preparing a modified acrylonitrile-butadiene-styrene resin having excellent matteness, impact resistance, and heat resistance, as well as having a low total volatile organic compounds content, and to a modified acrylonitrile-butadiene-styrene resin prepared thereby.

Abstract: The present invention provides a styrene-acrylonitrile (SAN) resin that exhibits significantly improved thermal resistance and, at the same time, can be produced at high productivity and is highly processable and highly moldable; and a method of producing the same by preparing and storing the solution containing a mixture of an N-substituted maleimide monomer and an unsaturated nitrile monomer at a particular temperature, introducing the solution and a styrene polymer into the polymerization reactor separately, and maintaining the first polymerization reactor and the second polymerization reactor at particular respective temperatures, thereby significantly reducing the amounts of oligomers contained in the SAN resin.

Abstract: Provided is a styrene resin composition including ?-methyl styrene, acrylonitrile and vinyl imidazole, and having an improved conversion rate while maintaining excellent mechanical and chemical properties, a styrene resin composition including the same, and a styrene resin molded product manufactured therefrom. Accordingly, the heat-resistant styrene copolymer is effective in improving a conversion rate without deformation and mechanical and chemical property decline of the material itself, and as a result, commercialization may be readily accomplished due to enhanced productivity. In addition, the styrene resin molded product manufactured from the styrene resin composition according to the present invention includes the heat-resistant styrene copolymer as a matrix copolymer, and therefore, has excellent impact strength, tensile strength, tensile elongation and flowability while having high heat resistance.

Abstract: Provided is a styrene resin composition including ?-methyl styrene, acrylonitrile and t-butyl methacrylate, and having an improved conversion rate while maintaining excellent mechanical and chemical properties, a styrene resin composition including the same, and a styrene resin molded product manufactured therefrom. Accordingly, the heat-resistant styrene copolymer is effective in improving a conversion rate without deformation and mechanical and chemical property decline of the material itself, and as a result, commercialization may be readily accomplished due to enhanced productivity. In addition, the styrene resin molded product manufactured from the styrene resin composition according to the present invention includes the heat-resistant styrene copolymer as a matrix copolymer, and therefore, has excellent impact strength, tensile strength, tensile elongation and flowability while having high heat resistance.

Abstract: The present invention relates to a method of preparing a styrene-based resin having a low oligomer content and a styrene-based resin prepared thereby. The preparation method according to the present invention may prepare a styrene-based resin having a reduced oligomer content by using a polymerization initiator having a 1 hour half-life temperature, which is 5° C. to 25° C. lower than a temperature during polymerization, and controlling devolatilization conditions.

Abstract: The present invention provides a method of preparing an aromatic vinyl-unsaturated nitrile-based copolymer in which, when an aromatic vinyl-unsaturated nitrile-based copolymer in which a content of a structural unit derived from unsaturated nitrile monomers in the copolymer is in the range of 22 to 30 wt % is prepared, oligomer content and unreacted monomer content are decreased, resulting in excellent heat resistance, significantly improved surface quality, and particularly, reduced generation of residue on a product surface when used in a closed high temperature environment and reduced occurrence of mold deposits during injection molding, and an aromatic vinyl-unsaturated nitrile-based copolymer prepared using the method.

Abstract: The present invention relates to a composition for preparing a SAN copolymer, a SAN copolymer, a preparation method therefor, a heat-resistant ABS resin blend comprising the same, and heat-resistant ABS pellets. Specifically, the present invention provides a composition for preparing a SAN copolymer, the composition comprising a monomer mixture, and ethylene glycol dimethacrylate as a chain extender, wherein the monomer mixture comprises 60 to 75 wt % of an ?-methylstyrene monomer and 25 to 40 wt % of an acrylonitrile-based monomer based on the total weight of the monomer mixture; and the ethylene glycol dimethacrylate is contained in an amount of 0.001 to 0.15 parts by weight based on 100 parts by weight of the monomer mixture.

Abstract: A backside illuminated image sensor includes a photodiode arranged in a substrate, a first insulating layer arranged on a front surface of the substrate, a bonding pad arranged on the first insulating layer, and a second insulating layer arranged on the first insulating layer and the bonding pad. The bonding pad is partially exposed by an opening passing through the substrate and the first insulating layer, and an edge portion of the bonding pad is supported by the first and second insulating layers.

Abstract: Disclosed is a (meth)acrylate-based resin composition comprising a poly(alkyl(meth)acrylate-phenyl(meth)acrylate) copolymer comprising phenyl(meth)acrylate having excellent surface hardness and a high refractive index, as a base resin and a (conjugated diene (meth)acrylate) graft copolymer having excellent impact absorption efficiency, the (meth)acrylate-based resin composition providing excellent transparency by exhibiting excellent impact resistance even using a small amount of impact modifier. The (meth)acrylate-based resin composition having excellent impact resistance and transparency comprises 1 to 29 wt % of the (conjugated diene-(meth)acrylate) graft copolymer and 71 to 99 wt % of the poly(alkyl(meth)acrylate-phenyl(meth)acrylate) copolymer.

Abstract: Disclosed are a heat-resistant SAN resin, a method of producing the same and a heat-resistant SAN resin composition comprising the same. More specifically, disclosed are a heat-resistant SAN resin produced using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, a method of producing the same and a heat-resistant SAN resin composition comprising the same. Advantageously, provided are a heat-resistant SAN resin with maintained heat resistance, improved polymerization conversion rate and increased weight average molecular weight, a method of producing the same, and a heat-resistant SAN resin composition containing the same with excellent chemical resistance, superior mechanical properties and good balance between properties.