Patents by Inventor Chang Hwa Park

Chang Hwa Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and method for manufacturing the same
    Patent number: 8564107
    Abstract: A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: October 22, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: In Kuk Cho, Kyoung Taek Park, Sang Soo Kwak, Eun Jin Kim, Jin Young Son, Chang Hwa Park
  • Lead Frame and Method For Manufacturing the Same
    Publication number: 20120001307
    Abstract: A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer.
    Type: Application
    Filed: February 23, 2010
    Publication date: January 5, 2012
    Applicant: LG Innotek Co., Ltd.
    Inventors: In Kuk Cho, Kyoung Taek Park, Sang Soo Kwak, Eun Jin Kim, Jin Young Son, Chang Hwa Park
  • LEAD FRAME AND MANUFACTURING METHOD THEREOF
    Publication number: 20110272184
    Abstract: Disclosed are a lead frame and a method for manufacturing the same. The lead frame includes a copper substrate and a rough copper layer having surface roughness of 110 nm to 300 nm on a surface of the copper substrate.
    Type: Application
    Filed: September 7, 2009
    Publication date: November 10, 2011
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Chang Hwa Park, Eun Jin Kim, Jin Young Son, Kyoung Taek Park, In Kuk Cho