Abstract: One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, commu

Abstract: Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.

Abstract: An apparatus for determining the blood pressure of a patient which allows the patient to first measure his measured blood pressure using a blood pressure measuring device and then, at a later time, estimate his current blood pressure using a blood pressure calculating device that includes a mathematical model for estimating blood pressure based on a current change in blood pressure induced by a heart beat and the previously measured blood pressure. The apparatus includes a transmitter device that detects the presence of a blood pressure calculating device connected to or in proximity of the blood pressure measuring device and transmits the previously measured blood pressure value to the blood pressure calculating device.