Abstract: Disclosed are a metal thin film precursor composition, a method of forming a thin film using the metal thin film precursor composition, and a semiconductor substrate fabricated using the method. The metal thin film precursor composition includes a metal thin film precursor compound and a growth regulator including a predetermined terminal group and structure. In a thin film deposition process, by using the metal thin film precursor composition, side reactions may be suppressed and thin film growth rate may be controlled appropriately. Since process by-products in a thin film are removed, even when the thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved. In addition, corrosion or deterioration may be prevented, and the crystallinity of the thin film may be improved, thereby improving the electrical properties of the thin film.

Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.

Abstract: Provided are a system and a method for allocating resources in a communication system. The method includes mapping a Transmission Time Interval (TTI) class according to channel information transmitted from a mobile station and service class information of the mobile station; and allocating resources by dynamically configuring a frame based on the mapped TTI class.

Abstract: A method for manufacturing a cone board including: preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins; and forming a first nickel layer on at least one surface of the core insulation layer by electroless plating

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract: A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.

Abstract: Provided are a system and a method for allocating resources in a communication system. The method includes mapping a Transmission Time Interval (TTI) class according to channel information transmitted from a mobile station and service class information of the mobile station; and allocating resources by dynamically configuring a frame based on the mapped TTI class.

Abstract: The present invention provides a core board and a manufacturing method thereof, in which the core board includes a nickel layer as a seed layer to improve the binding strength between an insulation layer and a conductive layer, so that it allows forming fine inner circuits by the semi-additive method.

Abstract: Disclosed herein is a method for forming a solder resist pattern which can replace conventional solder resist printing processes. The method for forming a solder resist pattern comprises the steps of: laminating a semi-cured thermosetting film on both sides of a substrate; and laser ablating the laminated thermosetting film according to a solder resist mask pattern.

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract: An apparatus for drying semiconductor wafers using IPA (Isopropyl Alcohol) vapor includes a first chamber for producing the IPA vapor, and a second chamber connected to the first chamber through an IPA supply line, for receiving the IPA vapor and drying semiconductor wafers using the IPA vapor. With the drying apparatus, the first and second chambers are separated from each other, which allows the process steps of producing the IPA vapor and the drying the wafers to be separately performed. The drying apparatus thus prevents particles from being generated in the second chamber during the drying process. The wafers can be dried without a variation in temperature in the second chamber. The IPA vapor is exhausted from the second chamber by introducing nitrogen into the second chamber. As a result, the IPA vapor in the second chamber is not liquified and thereby leaves no substance to adhere to a contact portion between a wafer carrier and each wafer.