Abstract: Disclosed is an apparatus for fabricating an ingot. The apparatus comprises a crucible to receive a source material, and a temperature difference compensating part on the source material. The temperature difference compensating part comprises a plurality of holes.

Abstract: The present invention relates to an apparatus for fabricating ingot including a crucible to accommodate a material, a top cover enclosing the circumference of the temperature difference compensative part, and a heat insulator to be disposed on the top cover.

Abstract: Disclosed are an apparatus for fabricating an ingot and a method for fabricating the ingot. The apparatus comprises a crucible to receive a source material, and a guide member over the source material. The guide member comprises a source material feeding part.

Abstract: Disclosed is an apparatus for attaching a seed. The apparatus for attaching the seed includes a holder fixing part to fix a seed holder; a pressing part to apply a pressure to the seed holder; and a seed fixing part provided under the seed holder to fix the seed.

Abstract: A semiconductor device comprises a base substrate, a pattern on the base substrate, a buffer layer on the base substrate, and an epitaxial layer on the buffer. The pattern is a self-assembled pattern. A method for growing a semiconductor crystal comprises cleaning a silicon carbide substrate, forming a self-assembled pattern on the silicon carbide substrate, forming a buffer layer on the silicon carbide substrate, and forming an epitaxial layer on the buffer layer. A semiconductor device comprises a base substrate comprising a pattern groove and an epitaxial layer on the base substrate. A method for growing a semiconductor crystal comprises cleaning a silicon carbide substrate, forming a self-assembled projection on the silicon carbide substrate, forming a pattern groove in the silicon carbide, and forming an epitaxial layer on the silicon carbide.

Abstract: Provided is a built-in type cooker including a heat dissipation part connected to an electronic component and exposed to the outside of the cabinet. The built-in type cooker include a cabinet having an upwardly opened polyhedral shape, a top plate covering a top surface of the cabinet, the electronic component installed within the cabinet, and the heat dissipation part in which at least portion thereof is exposed to the side of the cabinet, the heat dissipation part being connected to the electronic component.

Abstract: Provided is a built-in type cooker including a heat dissipation part connected to an electronic component and exposed to the outside of the cabinet. The built-in type cooker include a cabinet having an upwardly opened polyhedral shape, a top plate covering a top surface of the cabinet, the electronic component installed within the cabinet, and the heat dissipation part in which at least portion thereof is exposed to the side of the cabinet, the heat dissipation part being connected to the electronic component.