Patents by Inventor Chang J. Yoo

Chang J. Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220147045
    Abstract: Sensor data fusion systems that provide noise reduction and fault protection. The sensor data fusion system fuses data acquired by respective accelerometers having different attributes. For example, one accelerometer has low noise and high bias, while another accelerometer has high noise and low bias when measuring specific force. The high-noise, low-bias accelerometer may be a gravimeter. Gravimeters and traditional accelerometers measure the same physical variable, i.e., specific force. By combining an expensive gravimeter and low-cost accelerometers, a synthetic sensor having both low noise and low bias may be achieved. Such synthetic sensors may be utilized in a gravity anomaly-referenced navigation system to achieve improved navigation performance.
    Type: Application
    Filed: September 16, 2021
    Publication date: May 12, 2022
    Applicant: The Boeing Company
    Inventors: Rongsheng Li, Chang J. Yoo, Tung-Ching Tsao, Andrey Tolstov, Cody L. Gruebele
  • Patent number: 4972008
    Abstract: A low stress agent which increases the coherence of organic materials and an inorganic filler, decreases the modulus in molded articles which absorb stress and impact energy is prepared by a process which comprises preparing a silane-modified reactive liquid polymer from a silane coupling agent and a reactive liquid polymer containing functional groups or double bonds, treating the surface of an inorganic filler with a silane coupling agent, and reacting said silane modified reactive liquid polymer with said treated inorganic filler. An epoxy resin or phenol resin composition which contains the low stress agent is very suitable for use in encapsulating a semiconductor.
    Type: Grant
    Filed: November 23, 1988
    Date of Patent: November 20, 1990
    Assignee: Korea Chemical Co., Ltd.
    Inventors: Jung D. Lee, Chang J. Yoo, Moon Y. Lee
  • Patent number: 4942207
    Abstract: A suspension or emulsion polymerization process for the preparation of modified resin useful as a low-stress semiconductor encapsulant which comprises reacting a silicone oil or a silicone resin an having at least two silanol groups or hydrolyzable alkoxy groups with a silane coupling agent having at least two hydrolyzable alkoxy groups to form a suspension or emulsion of a reactive intermediate product, azeotropically distilling the resulting suspension or emulsion to produce a distrilled intermediate product, and adding an epoxy resin or a phenol resin to the distilled intermediate product to produce a matrix having insoluble and infusible spherical particles.
    Type: Grant
    Filed: July 24, 1989
    Date of Patent: July 17, 1990
    Assignee: Korea Chemical Co., Ltd.
    Inventors: Jung D. Lee, Chang J. Yoo, Moon Y. Lee