Abstract: A memory device includes a test mode detector circuit that determines whether the memory device has entered a test mode based on at least one test mode entry signal received through at least one pin of a plurality of pins and generates a test mode detection signal, and a test pad connection circuit that electrically couples a first pin of the plurality of pins to a dedicated test pad of the test mode such that a signal applied to the first pin is transmitted to the dedicated test pad based on the test mode detection signal.

Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.

Abstract: Methods of forming contacts for source/drain regions and a contact plug for a gate stack of a finFET device are disclosed herein. Methods include etching a contact opening through a dielectric layer to expose surfaces of a first source/drain contact and repairing silicon oxide structures along sidewall surfaces of the contact opening and along planar surfaces of the dielectric layer to prevent selective loss defects from occurring during a subsequent selective deposition of conductive fill materials and during subsequent etching of other contact openings. The methods further include performing a selective bottom-up deposition of conductive fill material to form a second source/drain contact. According to some of the methods, once the second source/drain contact has been formed, the contact plug may be formed over the gate stack.

Abstract: A flavoring sheet with improved physical properties, a smoking article including the same, and methods of producing the flavoring sheet and the smoking article are provided. The flavoring sheet according to some embodiments of the present disclosure may include a hydrocolloid material configured to form a sheet, a flavoring, and a plasticizer. The plasticizer can improve physical properties of the flavoring sheet and thus enhance workability of a process of cutting the flavoring sheet.

Abstract: Provided is a display device including a display panel, an optical sensor, a timing controller, a scan driver, a data driver, and an image controller. The timing controller controls an image refresh rate of the display panel based on a refresh rate control signal. Thus, the display device provides improved visibility.

Abstract: A system comprises a syringe pump and a special designed syringe. The syringe pump includes a housing with a flange holder for receiving a flange of the syringe barrel, an electrical motor disposed inside the housing, a plurality of gears driven by the electrical motor, a leadscrew connected to the plurality of gears, and a cage housing for housing the leadscrew and for holding at least partially the plunger. The flange of the plunger inserts into the flange holder, the leadscrew engages the plunger and moves the plunger in and out of the syringe.

Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.

Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.

Abstract: The present invention relates to a composition for preventing or treating heart failure including TREM2 protein or a fragment thereof as an active ingredient. The TREM2 protein or fragment thereof according to the present invention can be prepared as a soluble form and used as an injection, and when injected into the body, it promotes functional and structural improvement of the infarcted heart, and is effective for preventing or treating heart failure, and more specifically, it can be advantageously used for preventing or treating heart failure that appears as a sequela of myocardial infarction.

Abstract: A strain sensor may have a conductive elastic yarn including a first fiber having a predetermined length and a shape of a fiber yarn and a second fiber having electrical conductivity and a sheet shape. The strain sensor may have a pair of wiring members electrically connected to both ends of the conductive elastic yarn. The conductive elastic yarn, with the second fiber wrapped around the first fiber, is twisted in a coil shape.

Abstract: Provided are a method and apparatus for providing a network switching service to a user equipment.

Abstract: An example electronic device includes a display, a communication circuit, a memory, and at least one processor configured to, based on a signal for requesting transmission of identification information including a call word for using first mode of an artificial intelligence assistant function of the electronic device being received, from another electronic device, through the communication circuit using first communication method, control the display to display a user interface for requesting user confirmation for transmission of the identification information; control the communication circuit to transmit the identification information to the another electronic device as a result of user confirmation through the user interface; and receive information for using a second communication method from the another electronic device.

Abstract: Disclosed is a processor-implemented data processing method in a neural network. A data processing apparatus includes at least one processor, and at least one memory configured to store instructions to be executed by the processor and a neural network, wherein the processor is configured to, based on the instructions, input an input activation map into a current layer included in the neural network, output an output activation map by performing a convolution operation between the input activation map and a weight quantized with a first representation bit number of the current layer, and output a quantized activation map by quantizing the output activation map with a second representation bit number based on an activation quantization parameter.

Abstract: Provided are a method and apparatus for a user equipment, a core network, and a second device to enable bidirectional communication for second devices. The method of the second device may include receiving internet protocol (IP) configuration information for automatically configuring an IP version 6 (IPv6) address of the second device from a core network through a user equipment; generating the IPv6 address using information in the IP configuration information; and transmitting the generated IPv6 address to the core network through the UE.

Abstract: A transportation head for a microchip transfer device capable of minimizing mechanical and chemical damage to a microchip, a microchip transfer device having same, and a transfer method thereby, and the transportation head includes a head body having a pickup area and a dummy area; a first protruding pin disposed in the pickup area of the head body; and a liquid droplet attached to the first protruding pin.

Abstract: The present invention relates to a composition, for prevention or treatment of cancer diseases, comprising CD8+ T cells activated by CD4+ T cell-derived extracellular vesicles as an active ingredient. It was found that the secretion of extracellular vesicles from cytokine-activated CD4+ T cells increases and the extracellular vesicles enhance proliferation and activity of CD8+ T cells to induce the death of cancer cells, thereby augmenting an anticancer effect. Thus, the present invention provides the CD8+ T cells activated by CD4+ T cell-derived extracellular vesicles as a pharmaceutical agent or an immunotherapeutic agent for cancer diseases, and a method for activating CD8+ T cells by using CD4+ T cell-derived extracellular vesicles to prepare CD8+ T cells showing excellent anticancer activity as described above.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: Provided are a method and apparatus for providing a multi virtual local area network service to user equipments.