Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Abstract: Disclosed herein is a composition comprising a lipid nanoparticle and a double-stranded oligodeoxynucleotide (dsODN) encapsulated in the lipid nanoparticle. According to the embodiments of the present disclosure, the dsODN comprises two strands complementary to each other, in which the first strand comprises the nucleotide sequence of SEQ ID NO: 1. Also disclosed herein are methods of treating cancers by using the present composition.

Abstract: An array objective lens module, having an optical axis and including a substrate, multiple lens frames, and multiple objective lens sets is provided. The substrate includes multiple accommodating vias. Each accommodating via includes an internal thread structure. The lens frames are respectively disposed in the accommodating vias. Each lens frame includes an external thread structure. The external thread structure is adapted to the internal thread structure. The objective lens sets are respectively disposed in the lens frames. Each objective lens set includes at least one lens, and a relative position of each frame and the substrate in an extension direction of the optical axis changes according to a relative rotation angle of the corresponding external read structure and internal thread structure.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Abstract: Apparatus for monitoring and displaying the status of a local area network. The network includes a hub with ports for connection to various data terminal equipment in a star configuration and for connection to other hubs of the network. The hubs each have different types of plug-in modules which have ports for connecting the hub to different types of network cable such as fiber optic cable, unshielded twisted pair cable and shielded twisted pair cable. Information is automatically provided to a control console identifying the types of modules and the location of the modules in the hub so that an image of the actual hub can be displayed on the screen of the control console. The actual hub image shows the location and types of modules installed in the hub. In addition, information regarding the connection of each of the hubs to other hubs of the network is obtained and provided to the control console.