Patents by Inventor Chang-Kai Chao

Chang-Kai Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency connecting device with enhanced cooling efficiency of optical module
    Patent number: 10455739
    Abstract: A high-frequency connecting device includes a housing, a sandwiched member, an inner heat sink, a rear heat sink, a heat pipe, a upper heat sink and a connector. The inner heat sink is disposed inside the sandwiched member. The top and the bottom of the inner heat sink respectively have a first contact portion and a second contact portion. The upper heat sink has a third contact portion. A fourth contact portion is elastically disposed on the lower cover. The first and the second optical modules are respectively inserted into the upper and the lower spaces. The top and the bottom of the first optical module are in direct contact respectively with the third contact portion and the first contact portion, while the top and the bottom of the second optical module are in direct contact respectively with the second contact portion and the fourth contact portion.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 22, 2019
    Assignee: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An Su, Chang-Kai Chao
  • HIGH-FREQUENCY CONNECTING DEVICE WITH ENHANCED COOLING EFFICIENCY OF OPTICAL MODULE
    Publication number: 20190215989
    Abstract: A high-frequency connecting device includes a housing, a sandwiched member, an inner heat sink, a rear heat sink, a heat pipe, a upper heat sink and a connector. The inner heat sink is disposed inside the sandwiched member. The top and the bottom of the inner heat sink respectively have a first contact portion and a second contact portion. The upper heat sink has a third contact portion. A fourth contact portion is elastically disposed on the lower cover. The first and the second optical modules are respectively inserted into the upper and the lower spaces. The top and the bottom of the first optical module are in direct contact respectively with the third contact portion and the first contact portion, while the top and the bottom of the second optical module are in direct contact respectively with the second contact portion and the fourth contact portion.
    Type: Application
    Filed: June 1, 2018
    Publication date: July 11, 2019
    Inventors: Hou-An Su, Chang-Kai Chao