Patents by Inventor Chang-Kai Chu

Chang-Kai Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD
    Publication number: 20230345634
    Abstract: An information handling system includes a printed circuit board having a signal via fabricated through the printed circuit board. The signal via includes a conductive metal plating. The signal via also includes first and second via portions. The first via portion is connected to a first trace of a differential pair. The second via portion is connected to a second trace of the differential pair. The first and second via portions are formed in the conductive metal plating.
    Type: Application
    Filed: April 21, 2022
    Publication date: October 26, 2023
    Inventors: Chang-Kai Chu, Chang-Hsien Chen, Bhyrav Mutnury