Abstract: Provided is a secondary shutdown structure of a nuclear reactor, which uses sliding doors, and more particularly, to a secondary shutdown structure of a nuclear reactor, which uses sliding doors and is capable of shutting down a nuclear reactor reliably with a simple structure without using a boric acid solution.

Abstract: A display apparatus includes a plurality of inorganic light emitting diodes (LEDs) configured to form a single pixel, a plurality of signal electrodes configured to supply a data signal to the plurality of inorganic LEDs, and a common electrode configured to provide a ground to the plurality of inorganic LEDs.

Abstract: A secondary shutdown system for a nuclear reactor using melting seal includes a guide pipe located inside the nuclear reactor, a storage container communicating with the guide pipe and storing a neutron absorber therein, a sealing member provided in the storage container and configured to close an outlet of the storage container so that the neutron absorber stored in the storage container is not moved, and a hot wire configured to supply heat to the sealing member, wherein the sealing member is melted by the heat supplied by the hot wire to open the storage container and move the neutron absorber to the guide pipe.

Abstract: A display apparatus includes a plurality of inorganic light emitting diodes (LEDs) configured to form a single pixel, a plurality of signal electrodes configured to supply a data signal to the plurality of inorganic LEDs, and a common electrode configured to provide a ground to the plurality of inorganic LEDs.

Abstract: An apparatus for detecting a position of a control rod includes a control rod driving shaft having an outer circumferential surface on which position information is marked, a mirror configured to reflect the position information, and a detector configured to detect a position of the control rod driving shaft from the position information reflected from the mirror, when the control rod driving shaft moves vertically.

Abstract: A fingerprint recognition device includes: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

Abstract: Provided is a method for separating a nanogenerator, which includes laminating a buffer layer on a sacrificial substrate, making a nanogenerator on the buffer layer, laminating a metal layer on the nanogenerator and separating the nanogenerator from the buffer layer. Here, a nanogenerator is separated by using a stress difference between the sacrificial substrate and the metal layer, instead of an existing method in which a nanogenerator is separated from the sacrificial substrate by means of wet etching or the like. In particular, according to a difference between a tensile stress at the metal layer such as nickel and a compressive stress at the lower silicon substrate, the nanogenerator is intactly separated from the silicon oxide layer serving as a buffer layer. Therefore, the nanogenerator may be separated from the sacrificial substrate in a mechanical way, which is safer and more economic in comparison to an existing chemical separation method using an etching solution.

Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.

Abstract: Provided is a secondary shutdown structure of a nuclear reactor, which uses sliding doors, and more particularly, to a secondary shutdown structure of a nuclear reactor, which uses sliding doors and is capable of shutting down a nuclear reactor reliably with a simple structure without using a boric acid solution.

Abstract: An apparatus for detecting a position of a control rod includes a control rod driving shaft having an outer circumferential surface on which position information is marked, a mirror configured to reflect the position information, and a detector configured to detect a position of the control rod driving shaft from the position information reflected from the mirror, when the control rod driving shaft moves vertically.

Abstract: Disclosed are fingerprint recognition device having an improved structure to enable a driving device of an integrated circuit to have durability, a manufacturing method therefor, and an electronic device. The fingerprint recognition device comprise: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.

Abstract: Provided is a method for separating a nanogenerator, which includes laminating a buffer layer on a sacrificial substrate, making a nanogenerator on the buffer layer, laminating a metal layer on the nanogenerator and separating the nanogenerator from the buffer layer. Here, a nanogenerator is separated by using a stress difference between the sacrificial substrate and the metal layer, instead of an existing method in which a nanogenerator is separated from the sacrificial substrate by means of wet etching or the like. In particular, according to a difference between a tensile stress at the metal layer such as nickel and a compressive stress at the lower silicon substrate, the nanogenerator is intactly separated from the silicon oxide layer serving as a buffer layer. Therefore, the nanogenerator may be separated from the sacrificial substrate in a mechanical way, which is safer and more economic in comparison to an existing chemical separation method using an etching solution.

Abstract: Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.