Patents by Inventor Chang-Liang Lin
Chang-Liang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153820Abstract: A processing method of a processing apparatus is provided, including step 1, step 2, step 3, and step 4. Step 1 is providing an object having a processed surface, and dividing the processed surface into multiple processed regions, where there is at least one workpiece on each processed region. Step 2 is performing path computation according to the workpiece on each processed region, and generating a processing path in each processed region, where the processing paths in the processed regions are different from each other. Step 3 is performing processing operation by a processing apparatus according to the processing path in one of the processed regions obtained from step 2. Step 4 is moving the processing apparatus to a next processed region after finishing the processing operation on each workpiece in the one of the processed regions. A processing system is also provided.Type: ApplicationFiled: November 28, 2022Publication date: May 9, 2024Applicant: PlayNitride Display Co., Ltd.Inventors: Chang-Rong Lin, Ching-Liang Lin
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Publication number: 20240118222Abstract: A defect detection and removal apparatus including a removing unit, an image capturing unit, and a determining unit is provided. The removing unit is configured to remove at least one defective micro-element on a substrate. The image capturing unit is configured to capture a detection image of at least one defective micro-element correspondingly on the substrate. The determining unit is coupled to the image capturing unit and the removing unit. The image capturing unit executes capturing a first detection image before the removing unit executes removing a defective micro-element, and executes capturing a second detection image after the removing unit executes removing the defective micro-element. The determining unit confirms whether the defective micro-element has been removed according to the first and second detection image obtained from the image capturing unit. A defect detection and removal method is also provided.Type: ApplicationFiled: November 21, 2022Publication date: April 11, 2024Applicant: PlayNitride Display Co., Ltd.Inventors: Chang-Rong Lin, Ching-Liang Lin
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Publication number: 20150107887Abstract: An electric-element mount seat adapted to receive at least one electric element is disclosed. The electric-element mount seat includes a seat body that has a base wall and two opposite side walls extending from the base wall, and a plurality of pins that are separately disposed on the side walls of the seat body in a plug-in manner. Each of the pins includes a wire-wrapped section adapted to be electrically connected to the electric element. The wire-wrapped section has a rod portion that protrudes from the bottom surface of a corresponding one of the side walls in a top-down direction and a hook portion that extends from the rod portion and that is bent toward the rod portion.Type: ApplicationFiled: May 16, 2014Publication date: April 23, 2015Applicant: BOTHHAND ENTERPRISE INC.Inventor: Chang-Liang LIN
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Patent number: 8905789Abstract: An electronic device package box includes a base having a pin-protruding face and a first mounting face for mounting a plurality of electronic components thereto, a plurality of first pins mounted to the base for electrical connection with the electronic components and each including a first connection section protruding from the pin-protruding face, a cover connected to and cooperating with the base to define a packaging space, and a plurality of second pins mounted to the cover for electrical connection with a plurality of electronic components. The cover has a second mounting face for mounting the electronic components thereto. Each second pin includes a second connection section protruding from one of the base and the cover.Type: GrantFiled: September 13, 2012Date of Patent: December 9, 2014Assignee: Bothhand Enterprise Inc.Inventor: Chang-Liang Lin
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Publication number: 20130178104Abstract: An electronic device package box includes a base having a pin-protruding face and a first mounting face for mounting a plurality of electronic components thereto, a plurality of first pins mounted to the base for electrical connection with the electronic components and each including a first connection section protruding from the pin-protruding face, a cover connected to and cooperating with the base to define a packaging space, and a plurality of second pins mounted to the cover for electrical connection with a plurality of electronic components. The cover has a second mounting face for mounting the electronic components thereto. Each second pin includes a second connection section protruding from one of the base and the cover.Type: ApplicationFiled: September 13, 2012Publication date: July 11, 2013Applicant: BOTHHAND ENTERPRISE INC.Inventor: Chang-Liang LIN
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Publication number: 20080190587Abstract: A heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.Type: ApplicationFiled: August 16, 2007Publication date: August 14, 2008Inventors: Chang-Liang Lin, Chi-Lung Lee, Hui-Yuan Liang, Jiu-Yan Yan
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Publication number: 20080156519Abstract: A printed circuit board structure including a carrier face on which a conductive layer is for connecting with electronic elements and a heat pipe texture arranged inside and along the printed circuit board structure. The printed circuit board is made of a material with good thermal conductivity, whereby the heat generated by the electronic elements can be quickly conducted to the heat pipe texture and quickly dissipated.Type: ApplicationFiled: December 27, 2007Publication date: July 3, 2008Applicant: Bothhand Enterprise Inc.Inventors: Chang-Liang Lin, Chi-Lung Lee, Hui-Yuan Liang, Jiu-Yan Yan
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Publication number: 20080156520Abstract: A complex printed circuit board structure including a flexible printed wiring board and a heat-dissipating substrate bonded with the flexible printed wiring board. Parts of surface material of the flexible printed wiring board is removed to form depressions or through holes for laying electronic elements therein. The surfaces of the electronic elements can at least partially get closer to or directly contact the heat-dissipating substrate through the depressions or through holes of the flexible printed wiring board. Therefore, the heat generated by the electronic elements can be more quickly and directly conducted to the heat-dissipating substrate and dissipated at high efficiency.Type: ApplicationFiled: December 27, 2007Publication date: July 3, 2008Applicant: Bothhand Enterprise Inc.Inventors: Chang-Liang Lin, Chi-Lung Lee, Hui-Yuan Liang, Jiu-Yan Yan
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Publication number: 20070212844Abstract: A method for making a capacitor includes: forming an anode that has a main body and a lead; mounting securely an insulator washer on the lead such that the insulator washer is spaced apart from an upper end of the main body of the anode, the insulator washer dividing the lead of the anode into an upper end portion and a lower end portion; forming a dielectric layer on the main body and the lead of the anode such that the dielectric layer has a main portion covering the main body, and a lead portion covering the lower end portion of the lead of the anode; and forming a conductive layer on the dielectric layer such that the conductive layer covers the main portion of the dielectric layer and the lead portion of the dielectric layer.Type: ApplicationFiled: March 16, 2007Publication date: September 13, 2007Inventor: Chang-Liang Lin
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Publication number: 20070054516Abstract: A device to combine a transformer and a power supply connector comprises a main body, a transformer connected to the main body, and a power supply connector secured on the main body. The main body comprises feet. The power supply connector comprises a pin hander, or the power supply connector is an electrical wire for connection with network or the circuit board of communication equipment. This design can be modularized for mass production in order to lower manufacture cost.Type: ApplicationFiled: August 16, 2005Publication date: March 8, 2007Inventor: Chang-Liang Lin
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Publication number: 20050219049Abstract: An Ethernet power supply structure including a power module, a network power supply controlling module and a power/signal combination module. Via the network power supply controlling module, the power module provides necessary power for the power/signal combination module. The power module also directly provides necessary power for an external signal source such as a hub and inputs the data signal of the external signal source into the power/signal combination module. The power/signal combination module combines the data signal input by the external signal source with the power transmitted by the power module into a data signal associated with the power. Via the Ethernet line, the power and data signal can be simultaneously transmitted to a preset external unit such as a wireless base station.Type: ApplicationFiled: August 23, 2004Publication date: October 6, 2005Inventor: Chang-Liang Lin
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Patent number: 6857910Abstract: A telecommunication socket structure including a rigid housing defining an internal cavity and at least one resilient arm disposed in the cavity near an opening thereof. The resilient arm has a free end formed with a first and a second projecting sections which are adjacent to each other. The first and second projection sections are respectively positioned in forward and backward positions in the cavity. The surfaces of the first and second projection sections are respectively inward and outward inclined. In case an incorrect smaller telecommunication plug is inserted into the socket, a straight stopper section of the first projecting section facing outward will stop the plug from entering the socket. When a correct larger telecommunication plug is inserted into the socket, along the outward inclined face of the second projecting section, the plug will gradually press the second projecting section to bias the free end of the resilient arm to outer side of the cavity.Type: GrantFiled: January 2, 2003Date of Patent: February 22, 2005Inventor: Chang-Liang Lin
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Publication number: 20040132345Abstract: Telecommunication socket structure including a rigid housing defining an internal cavity and at least one resilient arm disposed in the cavity near an opening thereof. The resilient arm has a free end formed with a first and a second projecting sections which are adjacent to each other. The first and second projecting sections are respectively positioned in a narrower and a wider positions in the cavity. The surfaces of the first and second projecting sections are respectively inward and outward inclined. In case an incorrect smaller telecommunication plug is inserted into the socket, a straight stopper section of the first projecting section facing outward will stop the plug from entering the socket. When a correct larger telecommunication plug is inserted into the socket, along the outward inclined face of the second projecting section, the plug will gradually press the second projecting section to bias the free end of the resilient arm to outer side of the cavity.Type: ApplicationFiled: January 2, 2003Publication date: July 8, 2004Inventor: Chang-Liang Lin
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Publication number: 20030227366Abstract: Inductor structure and manufacturing method for the inductor structure. The inductor structure includes a frame body defining a cavity having two openings and a conductive coil unit fitted on a magnetic core. The coil unit and the magnetic core are movably disposed in a predetermined position in the cavity. A filling material is filled into the cavity to fix the coil unit and the magnetic core. The coil unit has two flattened terminals extending out of the cavity. The terminals are bent downward from the frame body and received in dents formed on a bottom wall of the frame body.Type: ApplicationFiled: June 5, 2002Publication date: December 11, 2003Inventor: Chang-Liang Lin
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Patent number: 6135819Abstract: A telecommunication socket capable of directly inserting or connecting with a modularized circuit, including a seat body and multiple first and second conductive wires. The seat body has four side walls defining a front insertion hole in which a plug can be fitted. The front ends of the first conductive wires are positioned on inner upper side of the seat body, while the rear ends of the first conductive wires extend out of the back face of the seat body. The second conductive wires are bent and positioned on lower side of the seat body with one end extending out of the back face of the seat body and with the other end extending out of the bottom face of the seat body. A modularized circuit board or an electronic element can be easily directly additionally connected between the rear ends of the first conductive wires and upper ends of the second conductive wires on the back face of the seat body.Type: GrantFiled: May 19, 1999Date of Patent: October 24, 2000Inventor: Chang-Liang Lin