Abstract: The invention relates to a method and apparatus for evaluating a network and for predicting network performance for a higher order modulation by analyzing network signals modulated using a lower order modulation format. A margin index may be generated for the current or projected modulation formats based on displacement vectors for received symbols to indicate a margin remaining before a codeword error occurs to alert the network operator of potential performance issues before actual codeword errors occur.

Abstract: A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. A method for forming the chip package is also provided.

Abstract: A sensing module is provided. The sensing module includes a sensing device. The sensing device includes a first substrate having a first surface and a second surface opposite thereto. The sensing device also includes a sensing region adjacent to the first surface and a conducting pad on the first surface. The sensing device further includes a redistribution layer on the second surface and electrically connected to the conducting pad. The sensing module also includes a second substrate and a cover plate bonded to the sensing device so that the sensing device is between the second substrate and the cover plate. The conducting pad is electrically connected to the second substrate through the redistribution layer. The sensing module further includes an encapsulating layer filled between the second substrate and the cover plate to surround the sensing device.

Abstract: A smart flexile smart curtain film is disclosed, a light transparency for the smart curtain film can be adjusted according to a voltage applied thereon. One of the embodiment shows that the smart curtain film is designed normal dark, and the transparency is related to the voltage applied. The greater voltage is applied the more transparent the smart curtain film displays. The smart curtain film is adaptive to be attached onto a surface of a window glass to form a smart window glass. During daytime, a person can adjust the transparency of the smart curtain to block some light beams from entering the room; and vice versa, during nighttime, a person can adjust the transparency of the smart curtain to block some light beams from exiting the room to keep one's privacy.

Abstract: A display panel includes a first substrate, a shading module, a second substrate, optical sensors, and a parallel-to-serial converter. The shading module is disposed on the first substrate. The second substrate is disposed corresponding to the first substrate. The optical sensors are disposed on the second substrate, and are disposed corresponding to the shading module. The optical sensors are configured to output sensing signals according to an offset amount between the optical sensors and the shading module. One of the optical sensors includes a first switch and a second switch, in which the first switch and the second switch are coupled in cascade. The parallel-to-serial converter is configured to generate the serial signal according to the sensing signals.

Abstract: A chip package includes a substrate, a conductive layer and a plurality of thermal dissipation connections. The substrate includes a light-sensing region and has an upper surface and a lower surface opposite to each other. The conductive layer is disposed at the lower surface of the substrate and includes a light-shielding dummy conductive layer substantially aligned with the light-sensing region. The thermal dissipation connections are disposed beneath the lower surface of the substrate.

Abstract: An image sensing device includes a printed circuit board, a chip package, and an adhesive layer. The printed circuit board has a concave portion. The chip package has a sensing surface and a bonding surface that is opposite to the sensing surface. The adhesive layer is disposed between the bonding surface of the chip package and the concave portion of the printed circuit board. The adhesive layer has an aggregation force. The chip package is bent through a surface of the concave portion and the aggregation force, such that the sensing surface of the chip package is an arc surface.

Abstract: System and method for test structure on a wafer. According to an embodiment, the present invention provides a test structure for testing an integrated circuit. For example, the test structure and the integrated circuit are manufactured on a same substrate material and the testing being conducted is in a temperature-controlled environment. The test structure includes a top structure positioned above the integrated circuit, the top structure including a first metal material, which includes a first electrical terminal and a second electrical terminal. The test structure also includes a bottom structure positioned below the integrated circuit, the bottom structure including a first silicon material. A first side structure is positioned between the top structure and the bottom structure and located next to a first side of the integrated circuit. A second side structure is positioned between the top structure and the bottom structure and located next to a second side of the integrated circuit.

Abstract: A solid-state fermentation method is provided. The method is provided for edible and medicinal microorganisms. A commensurate device is used for processing sterilization, inoculation, cultivation, drying, and collection. Cultivation substrates are filled in cultivation plates and placed on trays of a movable layer rack in a reaction fermenter for fermentation. Inner pipes provide inoculation, fluid nutrient, and air for fermentation of microorganisms. The reaction fermenter is accompanied with a dry circulation unit and a production collection unit for drying and collection. The solid-state fermentation processes are thus effectively integrated without the need of transferring fermented products between stations, which largely reduces contamination rate. Even more, there is no need to purchase automatic production equipments of high mechanical technologies.

Abstract: A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a conducting pad located on a substrate. A first opening penetrates the substrate and exposes the conducting pad. A redistribution layer is in the first opening to electrically connect to the conducting pad. A cover plate is located on the substrate and covers the conducting pad. The method also includes removing the cover plate of the sensing device. The method further includes bonding the sensing device to a circuit board after the removal of the cover plate. The redistribution layer in the first opening is exposed and faces the circuit board. In addition, the method includes mounting an optical component corresponding to the sensing device on the circuit board. A photosensitive module formed by the method is also provided.

Abstract: A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A first opening penetrates the substrate and exposes the conducting pad. A redistribution layer is in the first opening to electrically connect to the conducting pad. A cover plate is located on the first surface and covers the conducting pad. The method also includes bonding the sensing device to a circuit board. The cover plate is removed after bonding the sensing device to the circuit board. The method further includes mounting an optical component corresponding to the sensing device on the circuit board. A photosensitive module formed by the method is also provided.

Abstract: A method for forming a photosensitive module is provided. The method includes providing a substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A cover plate is provided on the first surface of the substrate. An opening is formed. The opening penetrates the substrate and exposes the conducting pad. A redistribution layer is formed in the first opening to electrically connect to the conducting pad. The cover plate is removed and a dicing process is performed to form a sensing device. The sensing device is bonded to a circuit board. An optical component is mounted on the circuit board and corresponds to the sensing device. A photosensitive module formed by the method is also provided.

Abstract: A chip package including a chip having an upper surface, a lower surface and a sidewall is provided. The chip includes a signal pad region adjacent to the upper surface. A first recess extends from the upper surface toward the lower surface along the sidewall. At least one second recess extends from a first bottom of the first recess toward the lower surface. The first and second recesses further laterally extend along a side of the upper surface, and a length of the first recess extending along the side is greater than that of the second recess extending along the side. A redistribution layer is electrically connected to the signal pad region and extends into the second recess. A method for forming the chip package is also provided.

Abstract: A method of forming a nitrogen-containing oxide film is disclosed. The method comprises (a) exposing a substrate to a first gas pulse having one of an oxygen-containing gas and a metal-containing gas; (b) exposing the substrate to a second gas pulse having the other of the oxygen-containing gas and the metal-containing gas to form an oxide film over the substrate; and (c) exposing the oxide film to a third gas pulse having a nitrogen-containing plasma to form a nitrogen-containing oxide film, wherein the nitrogen-containing oxide film has a nitrogen concentration between about 0.1 and about 3 atomic percent (at %).

Abstract: An optical lens includes a lens portion having an optical axis, and an exterior portion connected to an outer periphery of the lens portion. The exterior portion has first and second surfaces that are disposed along a direction parallel to the optical axis and spaced apart from each other, a first annular surface that extends from a periphery of the second surface parallelly with respect to the optical axis, and a second annular surface that interconnects the first annular surface and the first surface. The second annular surface extends obliquely with respect to the first annular surface.

Abstract: A solid-state fermentation method is provided. The method is provided for edible and medicinal microorganisms. A commensurate device is used for processing sterilization, inoculation, cultivation, drying, and collection. Cultivation substrates are filled in cultivation plates and placed on trays of a movable layer rack in a reaction fermenter for fermentation. Inner pipes provide inoculation, fluid nutrient, and air for fermentation of microorganisms. The reaction fermenter is accompanied with a dry circulation unit and a production collection unit for drying and collection. The solid-state fermentation processes are thus effectively integrated without the need of transferring fermented products between stations, which largely reduces contamination rate. Even more, there is no need to purchase automatic production equipments of high mechanical technologies.

Abstract: A sandal includes a sole and a drainage system. The sole is molded from a resilient material and has a top surface for supporting a human foot, and a bottom surface for contacting a walking surface. Further, the sole defines on the top surface a forwardmost toe region, an intermediate ball region, an intermediate arch region and a rearmost heel region that are of different heights to follow an anatomical contour of an undersurface of the human foot. The drainage system has a plurality of grooves defined throughout the top surface of the sole to define a plurality of islands of different heights on the toe, ball, arch and heel regions of the sole. The grooves have different slopes and extend over the toe, ball, arch and heel regions in a manner which guides liquid to flow laterally out of the sole.

Abstract: A bicycle light assembly includes a body having a light end and a clamp end. A resilient member is pivotably connected to the body and has a clamp portion which is cooperated with the clamp end of the body to be connected with the brake cable. When braking, the resilient member is pivoted relative to the body and activates the light unit in the light end of the body. An isolation ring is located between the light member of the light unit and the battery to increase the sensibility of the light unit.

Abstract: The invention relates to a method and apparatus for evaluating a network and for predicting network performance for a higher order modulation by analyzing network signals modulated using a lower order modulation format. A margin index may be generated for the current or projected modulation formats based on displacement vectors for received symbols to indicate a margin remaining before a codeword error occurs to alert the network operator of potential performance issues before actual codeword errors occur.