Patents by Inventor Chang Min Kim
Chang Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106043Abstract: Provided is a pouch secondary battery. The pouch-type secondary battery may include an electrode assembly and a pouch-type battery case. The pouch-type battery case may include a cup part configured to accommodate the electrode assembly, a pair of first sealing parts disposed at both sides of the cup part perpendicular to a length direction, and a second sealing part configured to connect the pair of first sealing parts to each other and disposed at one side of the cup part perpendicular to a width direction. When an area of the first sealing part is A mm2, and a weight of the electrode assembly is B g, a ratio A/B may be about 0.29 or more.Type: ApplicationFiled: September 22, 2023Publication date: March 28, 2024Applicant: LG Energy Solution, Ltd.Inventors: Hyun Jin Kim, Chang Ho Kim, Seon Uk Kim, Jae Min Kim
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Patent number: 11943987Abstract: A color conversion substrate and a display device are provided. The color conversion substrate includes a base substrate, a first color filter and a second color filter disposed on a surface of the base substrate, a first partition layer disposed between the first color filter and the second color filter, a second partition layer disposed on the first partition layer, a first wavelength conversion pattern disposed on the first color filter and a second wavelength conversion pattern disposed on the second color filter, wherein the first partition layer includes a first lower surface disposed on the first color filter and a second lower surface disposed on the second color filter.Type: GrantFiled: June 11, 2020Date of Patent: March 26, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Gak Seok Lee, Byung Chul Kim, In Ok Kim, Jae Min Seong, In Seok Song, Keun Chan Oh, Ji Eun Jang, Chang Soon Jang, Sun Kyu Joo, Ha Lim Ji
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Publication number: 20240098382Abstract: An image processing device including: a decision pixel manager for setting a decision area for a defect candidate pixel, and determining a first decision pixel and a second decision pixel, based on first phase information of pixels included in the decision area with respect to a first modulation frequency of a sensing light source among the pixels; a target pixel determiner for calculating a phase difference between the first decision pixel and the second decision pixel, based on second phase information of the pixels with respect to a second modulation frequency of the sensing light source, and determining the defect candidate pixel as a target pixel, corresponding to that the phase difference exceeds a predetermined reference value; and a phase corrector for changing a phase of the target pixel, based on the phase difference.Type: ApplicationFiled: February 28, 2023Publication date: March 21, 2024Applicant: SK hynix Inc.Inventors: Woo Young JEONG, Ja Min KOO, Tae Hyun KIM, Jae Hwan JEON, Chang Hun CHO
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Publication number: 20240091759Abstract: Disclosed herein is a method of depositing a transition metal single-atom catalyst including preparing a carbon carrier, and depositing a transition metal single-atom catalyst on the carbon carrier, in which the carbon carrier is surface-treated by an oxidation process, and wherein the deposition is carried out by an arc plasma process.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Jong Min KIM, Sang Hoon KIM, Chang Kyu HWANG, Seung Yong LEE, So Hye CHO, Jae Won CHOI
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Patent number: 11932709Abstract: The present invention relates to a diene-based rubber latex including a polymer aggregate and having an extra large diameter, a method for preparing same and a graft copolymer with a core-shell structure, including same and having excellent impact strength and surface properties. A diene-based rubber latex of which 14 wt % to 26 wt % has diameter of 100 nm to less than 300 nm, 62 wt % to 81 wt % has a diameter of 300 nm to less than 800 nm, and 5 wt % to 14 wt % has a diameter of 800 nm to less than 1000 nm, based on 100 wt % of total rubber particles.Type: GrantFiled: December 17, 2019Date of Patent: March 19, 2024Assignee: LG CHEM, LTD.Inventors: Chang Hong Bak, Young Hwan Jeong, Young Min Kim
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Patent number: 11935703Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: GrantFiled: January 9, 2023Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
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Patent number: 11935990Abstract: A light emitting diode including a side reflection layer. The light emitting diode includes: a semiconductor stack and a light exit surface having a roughened surface through which light generated from an active layer is emitted; side surfaces defining the light exit surface; and a side reflection layer covering at least part of the side surfaces. The light exit surface is disposed over a first conductivity type semiconductor layer opposite to the ohmic reflection layer, all layers from the active layer to the light exit surface are formed of gallium nitride-based semiconductors, and a distance from the active layer to the light exit surface is 50 ?m or more.Type: GrantFiled: November 29, 2021Date of Patent: March 19, 2024Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chae Hon Kim, Chang Youn Kim, Jae Hee Lim
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Patent number: 11936052Abstract: Provided is a fluorine-doped tin oxide support, a platinum catalyst for a fuel cell having the same, and a method for producing the same. Also described is a high electrical conductivity and electrochemical durability by doping fluorine to the tin oxide-based support through an electrospinning process. Thus, while resolving a degradation issue of the carbon support in the conventional commercially available platinum/carbon (Pt/C) catalyst, what is designed is to minimize an electrochemical elution of dopant or tin, which is a limitation of the tin oxide support itself and has excellent performance as a catalyst for a fuel cell.Type: GrantFiled: April 16, 2020Date of Patent: March 19, 2024Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Jin Young Kim, Jong Min Kim, Hee-Young Park, So Young Lee, Hyun Seo Park, Sung Jong Yoo, Jong Hyun Jang, Hyoung-Juhn Kim, Chang Won Yoon, Jonghee Han
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Publication number: 20240086603Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: SAMSUNG ELECTRONICS CO, LTD.Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE
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Publication number: 20240088197Abstract: A light emitting chip including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a first bonding layer interposed between the first and second LED sub-units, a second bonding layer interposed between second and third LED sub-units, and a first connection electrode electrically connected to and overlapping at least one of the first, second, and third LED sub-units, the first connection electrode having first and second opposing side surfaces, the first side surface having a first length and the second side surface having a second length, in which the difference in length between the first side surface and the second side surface of the first connection electrode is greater than a thickness of at least one of the LED sub-units.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Seoul Viosys Co., Ltd.Inventors: Jong Min JANG, Chang Yeon KIM, Myoung Hak YANG
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Publication number: 20240085088Abstract: The present invention relates to a refrigerator, and particularly, to a refrigerator characterized by comprising: a main body which includes an outer casing and an inner casing, wherein the outer casing has an opening formed in a back panel thereof, and the inner casing is provided within the outer casing and provides, in an upper part thereof, an ice-making compartment and a refrigerator compartment, and a freezer compartment in a lower part thereof; an evaporator casing which is provided between the outer casing and the inner casing and forms an installation space in communication with the ice-making compartment and the opening; an evaporator which is installed in the installation space via the opening and provides cold air to the ice-making compartment; and an insulating cover which opens and closes the opening. Accordingly, the evaporator can be installed from the outside of the back panel of the main body, thus allowing the installation space of the evaporator casing to remain securely sealed.Type: ApplicationFiled: October 16, 2019Publication date: March 14, 2024Applicant: WINIA ELECTRONICS CO., LTD.Inventors: Chang-Min KIM, Sung-Ik CHANG, Kwang Jin JOO
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Publication number: 20240090121Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jung BYUN, Jung Soo KIM, Sang Hyun SIM, Chang Min HA, Tae Hong MIN, Jin Won LEE
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Patent number: 11929389Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.Type: GrantFiled: May 19, 2021Date of Patent: March 12, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Youn-soo Kim, Seung-min Ryu, Chang-su Woo, Hyung-suk Jung, Kyu-ho Cho, Youn-joung Cho
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Publication number: 20240079388Abstract: A light module including a base substrate having a front surface, first and second electrodes disposed on the front surface, first and second emitters disposed on the front surface, a first molding covering the first emitter, and a second molding layer covering the second emitter, in which the first and second electrodes include a first region and a second region exposed from the base substrate, and an embedded region between the first region and the second region and not exposed to the outside, and a distance between the second region of the first electrode is connected to the first emitter and the second region of the second electrode connected to the second emitter is shorter than a distance between the first region of the first electrode connected to the first emitter and the first region of the second electrode connected the second emitter.Type: ApplicationFiled: October 30, 2023Publication date: March 7, 2024Inventors: Jong Min JANG, Chang Youn KIM
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Publication number: 20240079258Abstract: Disclosed in the present document is an apparatus for aligning a semiconductor chip for packaging according to an embodiment, the apparatus may include a radiation source configured to irradiate a plurality of semiconductor chips with radiation; the plurality of semiconductor chips vertically disposed with respect to the ground; a radiation sensor configured to detect the radiation that has penetrated the plurality of semiconductor chips; and an alignment unit configured to align and bond the plurality of semiconductor chips based on detection information acquired by the radiation sensor.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Chang Goo KANG, Jeong Min PARK, Su Jin KIM
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Publication number: 20240075988Abstract: An embodiment roof assembly for a vehicle includes a roof panel including a core, an upper skin attached to a top surface of the core, and a lower skin attached to a bottom surface of the core, a face sheet disposed above the roof panel, and a foam layer interposed between the roof panel and the face sheet.Type: ApplicationFiled: March 21, 2023Publication date: March 7, 2024Inventors: Kyung Min Yu, Dong Won Kim, Chang Hun Lee, Min Jun Kim, Young Ju Kim, Hyun Chul Lee
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Publication number: 20240080320Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.Type: ApplicationFiled: April 27, 2023Publication date: March 7, 2024Inventors: You Jin KIM, Jung Woo CHOI, Jenog Ryeol CHOI, Joong Seon KIM, Hong Chan YUN, Ju Ho CHUNG, Do Hyun YOUN, Hyung Min KIM, Hyun Ok CHOI, Chun Ho KIM, Soo Beom KIM, Min Jeong KIM, Chang Oh HEO, Eun Soo HEO
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Publication number: 20240066570Abstract: A cassette for ultra-thin glass includes a pair of plates spaced apart from and facing each other, and a plurality of supports mounted between the pair of plates and including a plurality of mounting grooves that support sides of sheets of ultra-thin glass. Each of the plurality of mounting grooves includes an inclined portion inclined toward a middle of each of the plurality of mounting grooves, and a straight portion extending from the inclined portion and having a constant width in an axial direction of the plurality of supports. A height of the straight portion in a radial direction of the plurality of supports is equal to or greater than a height of the inclined portion in the radial direction.Type: ApplicationFiled: May 5, 2023Publication date: February 29, 2024Applicant: Samsung Display Co., LTD.Inventors: Jung Hoon OH, Ki Taek KIM, Chang Min LEE
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Patent number: 11915782Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.Type: GrantFiled: August 20, 2021Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang Min Lee, Nam Hyung Kim, Dae Jeong Kim, Do Han Kim, Min Su Kim, Deok Ho Seo, Won Jae Shin, Yong Jun Yu, Il Gyu Jung, In Su Choi
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Patent number: 11912102Abstract: An air conditioner for a vehicle including an air-conditioning case divided into a plurality of air passageways by a separation wall. A heating heat exchanger is disposed inside the air-conditioning case and exchanges heat with air to heat the interior of the vehicle. A perforated member is disposed at a downstream side of the heating heat exchanger and has a plurality of perforated holes through which the air passing the heating heat exchanger passes, and a partition wall is disposed between the heating heat exchanger and the perforated member to divide the air passageway of the air-conditioning case into a plurality of air passageways, wherein the partition wall is formed integrally with the perforated member.Type: GrantFiled: October 8, 2019Date of Patent: February 27, 2024Assignee: HANON SYSTEMSInventors: Dong Won Lee, Jong Su Kim, Jae Woo Ko, Young Keun Kim, Chang Soo Bae, Jong Min Lee, Gyu Ik Han