Patents by Inventor Chang Ming-Lan

Chang Ming-Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure with a retarding structure and method of making same
    Patent number: 7067358
    Abstract: An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: June 27, 2006
    Assignee: Tai-Saw Technology Co., Ltd.
    Inventors: Huang Chen-Tung, Tu Jim-Tren, You Hsang-Hsing, Lu Huang-An, Chang Ming-Lan, Lee Tai-Ying
  • Package structure with a retarding structure and method of making same
    Publication number: 20050205984
    Abstract: An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.
    Type: Application
    Filed: May 23, 2005
    Publication date: September 22, 2005
    Applicant: Tai-Saw Technology Co., Ltd.
    Inventors: Huang Chen-Tung, Tu Jim-Tren, You Hsang-Hsing, Lu Huang-An, Chang Ming-Lan, Lee Tai-Ying