Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: The present invention relates to an in-line strainer including: a body formed of a linear pipe having an enlarged part formed increased in diameter in the middle portion thereof, and a fastening flange mounted at the both ends thereof in such a manner as to be connected coaxially to a pipeline by means of a gasket; and a mesh screen having a generally conical shape at the front end portion thereof and a generally cylindrical shape at the back end portion thereof in such a manner as to be coupled to the body, the mesh screen being inserted from the outlet port of the body and being disposed concentrically into the enlarged part of the body in such a manner as to place the front end portion thereof into the enlarged part of the body, having a predetermined space from the inlet port of the body.

Abstract: Disclosed is a safety crampon with generality put on, which encircles front/rear/left/right sides of shoes around a spike pad to elastically press and grip them so that the crampon is not come off from the shoes, thereby ensuring safety. Also, the safety crampon has excellent wearing feeling and walking owing to characteristics of an elastic material, can be put on all kinds of shoes including mountain-climbing boots, high-heeled shoes, and rubber shoes, allows a user to safely climb a mountain and safely walk on a skiddy icy road of the ground, and has a conveniently portable advantage.