Abstract: A test system for a semiconductor device couples the device to the back side of a circuit board, thereby allowing the device to be tested under actual operating conditions while providing adequate clearance around the device to accommodate automatic handling equipment, and also reducing signal delay and distortion. A system in accordance with the present invention includes a circuit board having circuitry adapted to provide an actual operating environment for the semiconductor device, as for example, a low cost mother board for testing memory devices. The device is coupled to the back side of the circuit board through test terminals formed on the back side of the board. An interface board can be used to correct the pin arrangements, which are reversed because they protrude from the back side of the board, and to compensate for the environmental differences caused by use of sockets and additional equipment on the interface board.

Abstract: Semiconductor devices are tested under actual operating conditions by interfacing the devices to an actual board-type product, for example, through a test board tat includes a mounting unit such as a socket or pattern of conductive lands that allows the devices being tested to be mounted to and removed from the test board with minimal effort and signal degradation. An interface circuit on the test board compensates for environmental differences between the board-type product and the mounting unit. For example, the interface circuit can include a clock distribution circuit, which utilizes a phase locked loop, and a register circuit to compensate for electrical loading caused by the device mounting unit, and to provide the proper timing margins between clock signals and control signals applied to the semiconductor devices. A power control circuit can be used to manipulate the supply voltage thereby providing a voltage margin screening function.

Abstract: A method and apparatus for testing semiconductor devices allows devices to be tested under actual operating conditions by interfacing the devices to an actual board-type product. The semiconductor devices are interfaced to the board-type product with a test board that includes a mounting unit such as a socket or pattern of conductive lands that allows the devices being tested can be easily mounted to and removed from the test board with minimal effort and signal degradation. An interface circuit on the test board compensates for environmental differences between the board-type product and the mounting unit. For example, the interface circuit can include a clock distribution circuit, which utilizes a phase locked loop, and a register circuit to compensate for electrical loading caused by the device mounting unit, and to provide the proper timing margins between clock signals and control signals applied to the semiconductor devices.

Abstract: Embodiments of the invention allow semiconductor devices to be tested under actual operating conditions by interfacing the devices to an actual board-type product. The devices are interfaced to the board-type product with a test board that includes a mounting unit such as a socket or pattern of conductive lands that allows the devices to be easily mounted to and removed from the test board with minimal effort and signal degradation. An interface circuit on the test board compensates for environmental differences between the board-type product and the mounting unit. A power control circuit can be used to manipulate the supply voltage applied to the semiconductor devices, thereby providing a voltage margin screening function.

Abstract: A test system for a semiconductor device couples the device to the back side of a circuit board, thereby allowing the device to be tested under actual operating conditions while providing adequate clearance around the device to accommodate automatic handling equipment, and also reducing signal delay and distortion. A system in accordance with the present invention includes a circuit board having circuitry adapted to provide an actual operating environment for the semiconductor device, as for example, a low cost mother board for testing memory devices. The device is coupled to the back side of the circuit board through test terminals formed on the back side of the board. An interface board can be used to correct the pin arrangements, which are reversed because they protrude from the back side of the board, and to compensate for the environmental differences caused by use of sockets and additional equipment on the interface board.

Abstract: A method and apparatus for testing memory devices under actual operating conditions can accommodate non-standard memory devices through the use of an interface board that adapts a non-standard pin configuration to a standard pin configuration on a test substrate. The interface board can include a first surface on which to mount the non-standard device, a pin matching circuit, and a second surface constructed and arranged to couple the pin matching circuit to a standard pin configuration. The interface board can be mounted directly on the test substrate, or coupled to the test substrate through various arrangements of sockets, connection boards, and supports.

Abstract: A test system for a semiconductor device couples the device to the back side of a circuit board, thereby allowing the device to be tested under actual operating conditions while providing adequate clearance around the device to accommodate automatic handling equipment, and also reducing signal delay and distortion. A system in accordance with the present invention includes a circuit board having circuitry adapted to provide an actual operating environment for the semiconductor device, as for example, a low cost mother board for testing memory devices. The device is coupled to the back side of the circuit board through test terminals formed on the back side of the board. An interface board can be used to correct the pin arrangements, which are reversed because they protrude from the back side of the board, and to compensate for the environmental differences caused by use of sockets and additional equipment on the interface board.

Abstract: A method and apparatus for testing memory devices under actual operating conditions can accommodate non-standard memory devices through the use of an interface board that adapts a non-standard pin configuration to a standard pin configuration on a test substrate. The interface board can include a first surface on which to mount the non-standard device, a pin matching circuit, and a second surface constructed and arranged to couple the pin matching circuit to a standard pin configuration. The interface board can be mounted directly on the test substrate, or coupled to the test substrate through various arrangements of sockets, connection boards, and supports.

Abstract: A method and apparatus for testing semiconductor devices allows devices to be tested under actual operating conditions by interfacing the devices to an actual board-type product. The semiconductor devices are interfaced to the board-type product with a test board that includes a mounting unit such as a socket or pattern of conductive lands that allows the devices being tested can be easily mounted to and removed from the test board with minimal effort and signal degradation. An interface circuit on the test board compensates for environmental differences between the board-type product and the mounting unit. For example, the interface circuit can include a clock distribution circuit, which utilizes a phase locked loop, and a register circuit to compensate for electrical loading caused by the device mounting unit, and to provide the proper timing margins between clock signals and control signals applied to the semiconductor devices.

Abstract: A test system for a semiconductor device couples the device to the back side of a circuit board, thereby allowing the device to be tested under actual operating conditions while providing adequate clearance around the device to accommodate automatic handling equipment, and also reducing signal delay and distortion. A system in accordance with the present invention includes a circuit board having circuitry adapted to provide an actual operating environment for the semiconductor device, as for example, a low cost mother board for testing memory devices. The device is coupled to the back side of the circuit board through test terminals formed on the back side of the board. An interface board can be used to correct the pin arrangements, which are reversed because they protrude from the back side of the board, and to compensate for the environmental differences caused by use of sockets and additional equipment on the interface board.