Patents by Inventor Chang-Pin Chang

Chang-Pin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallization on a surface and in through-holes of a substrate and a catalyst used therein
    Publication number: 20100075026
    Abstract: A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.
    Type: Application
    Filed: October 30, 2008
    Publication date: March 25, 2010
    Applicant: NATIONAL DEFENSE UNIVERSITY
    Inventors: Yuh Sung, Ming-Der Ger, Chang-Pin Chang, Chun-Chieh Tseng, Wen-Ding Chen