Patents by Inventor Chang-Pin Huang

Chang-Pin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reducing delamination between an underfill and a buffer layer in a bond structure
    Patent number: 8610267
    Abstract: A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: December 17, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen, Tung-Liang Shao, Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii
  • ENHANCED DEATH RECEPTOR AGONISTS
    Publication number: 20130064838
    Abstract: Methods and compositions for treatment of cancer in a human patient comprising administering a therapeutically effective amount of an Fc-polypeptide agonist of DR5 having high-affinity to FCGR3A. Methods of making the Fc-polypeptides are provided.
    Type: Application
    Filed: May 13, 2011
    Publication date: March 14, 2013
    Applicant: AMGEN INC.
    Inventors: Jonathan David Graves, Jennifer Joy Kordich, Susan Ellen Cottrell, Chang-Pin Huang
  • Heterocyclic compounds
    Patent number: 8372849
    Abstract: This invention relates to heterocyclic compounds of the formulas shown in the specification. It also relates to methods for treating inflammatory diseases or immune diseases, developmental or degenerative diseases, and tissue injuries with one of the heterocyclic compounds.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: February 12, 2013
    Assignee: Taigen Biotechnology Co., Ltd.
    Inventors: Chi-Feng Yen, Cheng-Kung Hu, Chang-Pin Huang, Ying-Huey Huang, Gholam Hossein Hakimelahi, Chi-Hsin Richard King
  • Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure
    Publication number: 20120018875
    Abstract: A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 26, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen, Tung-Liang Shao, Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii
  • Heterocyclic Compounds
    Publication number: 20090264339
    Abstract: This invention relates to heterocyclic compounds of the formulas shown in the specification. It also relates to methods for treating inflammatory diseases or immune diseases, developmental or degenerative diseases, and tissue injuries with one of the heterocyclic compounds.
    Type: Application
    Filed: November 3, 2008
    Publication date: October 22, 2009
    Applicant: TaiGen Biotechnology Co., Ltd.
    Inventors: Chi-Feng Yen, Cheng-Kung Hu, Chang-Pin Huang, Ying-Huey Huang, Gholam Hossein Hakimelahi, Chi-Hsin Richard King
  • Synthesis of amino-protected cyclohexane-1,4-diyldimethanamine and its derivatives
    Publication number: 20080242861
    Abstract: This invention relates to methods of preparing the compounds of formula (V): Each variable in this formula is defined in the specification.
    Type: Application
    Filed: April 2, 2007
    Publication date: October 2, 2008
    Inventors: Chi-Feng Yen, Chang-Pin Huang, Cheng-Kung Hu, Ming-Chen Chou, Chi-Hsin Richard King