Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: Disclosed is a signal filter assembly, which includes a circuit board electrically connected between a cable and a high frequency electric connector, and a plurality of filters installed in the circuit board and respectively electrically connected to the signal wires of the transmission wires of the cable, each filter being formed of a parallel circuit of a resistor and a capacitor.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract: A wall plate assembly includes a wall plate with an insertion slot for the installation of a HDMI (High-Definition Multimedia Interface) connector of a HDMI cable, a signal amplifier connected to the back side of the wall plate for receiving the installed HDMI connector and amplifying the signal, and a support device, which comprises a vertical support frame vertically adjustably fastened to the wall plate below the insertion slot and a horizontal support frame horizontally adjustably fastened to the vertical support frame for holding down the installed HDMI connector on the vertical support frame.

Abstract: Disclosed is a signal filter assembly, which includes a circuit board electrically connected between a cable and a high frequency electric connector, and a plurality of filters installed in the circuit board and respectively electrically connected to the signal wires of the transmission wires of the cable, each filter being formed of a parallel circuit of a resistor and a capacitor.