Patents by Inventor Chang-Seon Jeon

Chang-Seon Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12004548
    Abstract: A method for producing black ginseng concentrate is characterized by including steps of adding red ginseng to a continuous steaming-dryer followed by steaming, cooling, and drying to prepare black ginseng, carrying out extraction by adding alcohol to crushed black ginseng obtained by crushing the black ginseng prepared above followed by filtration to prepare black ginseng extract, and concentrating the black ginseng extract prepared above by using a plate type evaporative concentrator followed by heat treatment, and the present invention also relates to black ginseng concentrate prepared by the aforementioned method.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: June 11, 2024
    Assignee: DAEDONG KOREA GINSENG CO., LTD
    Inventors: Sung-Keun Choi, Sung Soo Jang, Chang-Soon Lee, Byeong-Seon Jeon, Kun Hee Lee, Kyung Su Lee, Han Sol Lee, Hye Jeong Jeon, Byoung Man Kong
  • Publication number: 20100139715
    Abstract: A cleaning equipment includes a moving module moving a wafer from a first position to a second position, and a cleaning module provided at a third position between the first and second positions and including a plurality of cells, each cell having one or more pairs of outlets and inlets, the outlets for discharging a chemical solution onto the wafer and the inlets for drawings the chemical solution from the wafer, in a movement path of the wafer. The plurality of cells are individually operated.
    Type: Application
    Filed: November 16, 2009
    Publication date: June 10, 2010
    Inventors: Sang-Jine Park, Chang-Seon Jeon, Young-Eun Kim
  • Publication number: 20060137977
    Abstract: Disclosed is a wafer electroplating apparatus, which includes an electroplating bath comprising an anode in the electroplating bath, an electroplating solution, and a cathode located on the top of the electroplating bath and on to which a wafer is mounted. The cathode comprises a first portion electrically connected to an edge of the wafer, and a second portion extending from the first portion and electrically connected to a side of the wafer. The direct contact of the cathode with the side and front edges of the wafer ensures uniform distribution of the electrical field on the wafer during the electroplating process. Consequently, a uniform thickness of metal film deposition is achieved.
    Type: Application
    Filed: November 18, 2005
    Publication date: June 29, 2006
    Inventor: Chang-Seon Jeon