Patents by Inventor CHANG-SEUNG HA

CHANG-SEUNG HA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11127573
    Abstract: An embodiment includes a support unit, substrate treating apparatus and substrate treating method. The substrate treating apparatus comprises: a process chamber having a treatment space inside thereof; a support unit for supporting a substrate inside of the process chamber; and a gas supply unit for supplying the treatment gas into the treatment space, wherein the support unit comprises: an electrode layer of a metal material to which a high frequency electric power can be applied; a ground line having one end connected to the electrode layer and the other end grounded; and a switch provided on the ground line.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: September 21, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Doo Ho Lim, Chang-Seung Ha, Seungbae Lee
  • Publication number: 20200194241
    Abstract: An embodiment includes a support unit, substrate treating apparatus and substrate treating method. The substrate treating apparatus comprises: a process chamber having a treatment space inside thereof; a support unit for supporting a substrate inside of the process chamber; and a gas supply unit for supplying the treatment gas into the treatment space, wherein the support unit comprises: an electrode layer of a metal material to which a high frequency electric power can be applied; a ground line having one end connected to the electrode layer and the other end grounded; and a switch provided on the ground line.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 18, 2020
    Inventors: Doo Ho LIM, Chang-Seung HA, Seungbae LEE
  • Patent number: 10607818
    Abstract: An embodiment includes a support unit, substrate treating apparatus and substrate treating method. The substrate treating apparatus comprises: a process chamber having a treatment space inside thereof; a support unit for supporting a substrate inside of the process chamber; and a gas supply unit for supplying the treatment gas into the treatment space, wherein the support unit comprises: an electrode layer of a metal material to which a high frequency electric power can be applied; a ground line having one end connected to the electrode layer and the other end grounded; and a switch provided on the ground line.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: March 31, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Doo Ho Lim, Chang-Seung Ha, Seungbae Lee
  • Publication number: 20170345625
    Abstract: An embodiment includes a support unit, substrate treating apparatus and substrate treating method. The substrate treating apparatus comprises: a process chamber having a treatment space inside thereof; a support unit for supporting a substrate inside of the process chamber; and a gas supply unit for supplying the treatment gas into the treatment space, wherein the support unit comprises: an electrode layer of a metal material to which a high frequency electric power can be applied; a ground line having one end connected to the electrode layer and the other end grounded; and a switch provided on the ground line.
    Type: Application
    Filed: May 26, 2017
    Publication date: November 30, 2017
    Inventors: DOO HO LIM, CHANG-SEUNG HA, SEUNGBAE LEE