Patents by Inventor Chang-Sheng TSENG

Chang-Sheng TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177230
    Abstract: An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is XA(1+?AYA), in which XA is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, YA is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and ?A is a slope coefficient of the respective first bump.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 16, 2021
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Hsien-Wen Lo, Chang-Sheng Tseng
  • Publication number: 20210210451
    Abstract: An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is XA(1+?AYA), in which XA is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, YA is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and ?A is a slope coefficient of the respective first bump.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 8, 2021
    Inventors: Hsien-Wen LO, Chang-Sheng TSENG