Patents by Inventor Chang Su Oh
Chang Su Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240094251Abstract: A test socket including: a testing probe including a lower plunger in contact with a pad; an upper plunger coupled to the lower plunger; a spring probe made of a cylindrical spring for applying elasticity to the lower plunger and the upper plunger; and a contact probe with an upper side contacting a terminal of a test device and a lower side contacting the upper plunger; a socket housing that provides housing holes and accommodates the contact probe and the spring probe so that an upper side of the contact probe protrudes at each housing hole; and a cover that provides cover holes and is fastened to the socket housing so that a lower side of the lower plunger protrudes at each cover hole, wherein the upper plunger provides a sliding groove, the lower plunger provides a pair of sliding protrusions inserted into the sliding groove.Type: ApplicationFiled: September 18, 2023Publication date: March 21, 2024Applicant: TSE CO., LTDInventor: Chang Su OH
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Patent number: 11763959Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.Type: GrantFiled: October 23, 2019Date of Patent: September 19, 2023Assignee: TSE CO., LTD.Inventors: Chang Su Oh, Bo Hyun Kim, Sung Ho Yoon
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Patent number: 11609244Abstract: The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.Type: GrantFiled: March 24, 2021Date of Patent: March 21, 2023Assignee: TSE CO., LTD.Inventors: Chang Su Oh, Bo Hyun Kim
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Patent number: 11573248Abstract: The present disclosure discloses a test socket including an inelastic insulating housing formed of an inelastic insulating material having a plurality of housing holes, and a plurality of electro-conductive parts comprising electro-conductive particles in an elastic insulating material, the electro-conductive parts including an electro-conductive part body having a lower end portion to be connected to a signal electrode of the tester, an upper end portion to be connected to the terminal of the device under inspection, and an electro-conductive part bump connected to the electro-conductive part body to protrude from one or both of an upper and lower surface of the inelastic insulating housing.Type: GrantFiled: August 16, 2021Date of Patent: February 7, 2023Assignee: TSE CO., LTD.Inventor: Chang Su Oh
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Patent number: 11506705Abstract: The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.Type: GrantFiled: September 7, 2021Date of Patent: November 22, 2022Assignee: TSE CO., LTD.Inventor: Chang Su Oh
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Publication number: 20220099730Abstract: The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.Type: ApplicationFiled: September 7, 2021Publication date: March 31, 2022Inventor: Chang Su Oh
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Publication number: 20220057433Abstract: The present disclosure discloses a test socket including an inelastic insulating housing formed of an inelastic insulating material having a plurality of housing holes, and a plurality of electro-conductive parts comprising electro-conductive particles in an elastic insulating material, the electro-conductive parts including an electro-conductive part body having a lower end portion to be connected to a signal electrode of the tester, an upper end portion to be connected to the terminal of the device under inspection, and an electro-conductive part bump connected to the electro-conductive part body to protrude from one or both of an upper and lower surface of the inelastic insulating housing.Type: ApplicationFiled: August 16, 2021Publication date: February 24, 2022Inventor: Chang Su Oh
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Patent number: 11233352Abstract: The purpose of the present disclosure is to provide a electro-conductive part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the electro-conductive part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package, and more specifically, the electro-conductive part protecting members capable of being elastically modified in the longitudinal direction of the electro-conductive parts by having a hollow tube-shaped protection member body encompassing the electro-conductive parts, and a spiral groove to promote elasticity provided along the circumference of the protection member body so as to pass through the inside and the outside of the protection member body.Type: GrantFiled: January 3, 2020Date of Patent: January 25, 2022Assignee: TSE CO., LTD.Inventors: Chang Su Oh, Bo Hyun Kim, Sung Ho Yoon
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Publication number: 20220005626Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.Type: ApplicationFiled: October 23, 2019Publication date: January 6, 2022Inventors: Chang Su Oh, Bo Hyun Kim, Sung Ho Yoon
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Patent number: 11199577Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.Type: GrantFiled: March 17, 2021Date of Patent: December 14, 2021Assignee: TSE CO., LTD.Inventors: Chang Su Oh, Bo Hyun Kim
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Publication number: 20210313730Abstract: The purpose of the present disclosure is to provide a conductor part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the conductor part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package.Type: ApplicationFiled: January 3, 2020Publication date: October 7, 2021Inventors: Chang Su Oh, Bo Hyun Kim, Sung Ho Yoon
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Publication number: 20210302468Abstract: The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.Type: ApplicationFiled: March 24, 2021Publication date: September 30, 2021Inventors: Chang Su Oh, Bo Hyun Kim
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Publication number: 20210302494Abstract: A test socket according to the present disclosure is provided in a test apparatus in which a device under inspection having a terminal is connected to a tester, which generates a test signal, for testing the device under inspection, the test socket includes a nonelastic insulating housing formed of a nonelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction; and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, the electrically-conductive part having a lower end portion connected to a signal electrode of the tester placed below the nonelastic insulating housing and an upper end portion disposed in the housing hole to be connected to the terminal of the device under inspection placed on the nonelastic insulating housing.Type: ApplicationFiled: March 23, 2021Publication date: September 30, 2021Inventor: Chang Su Oh
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Patent number: 11131707Abstract: A test socket according to the present disclosure is provided in a test apparatus in which a device under inspection having a terminal is connected to a tester, which generates a test signal, for testing the device under inspection, the test socket includes a nonelastic insulating housing formed of a nonelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction; and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, the electrically-conductive part having a lower end portion connected to a signal electrode of the tester placed below the nonelastic insulating housing and an upper end portion disposed in the housing hole to be connected to the terminal of the device under inspection placed on the nonelastic insulating housing.Type: GrantFiled: March 23, 2021Date of Patent: September 28, 2021Assignee: TSE CO., LTD.Inventor: Chang Su Oh
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Publication number: 20210293880Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.Type: ApplicationFiled: March 17, 2021Publication date: September 23, 2021Inventors: Chang Su Oh, Bo Hyun Kim