Patents by Inventor Chang Sung HEU

Chang Sung HEU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210017435
    Abstract: The present disclosure relates to a novel high-performance latent heat storage composite manufactured by forming a network of protective nanostructures on the surface of a metal material having high thermal conductivity. Through a low volume content of a network having high thermal conductivity, high-density heat capacity may be secured. In addition, through use of a metal-based material having high thermal conductivity, thermal conductivity may be increased by about 7 times compared to a conventional pure phase change material.
    Type: Application
    Filed: July 17, 2020
    Publication date: January 21, 2021
    Applicant: Industry-University Cooperation Foundation Hanyang University
    Inventors: Dong Rip KIM, Hyeon Woo Son, Su Ho Kim, Chang Sung Heu, Heung Soo Lee
  • Publication number: 20210018275
    Abstract: The present disclosure relates to a phase change composite and a heat spreader including the same, and more particularly, to a phase change composite having improved cooling performance by being formed in a layer-by-layer structure composed of a material having high thermal conductivity and a phase change material. According to the present disclosure, by repeatedly laminating thermal conductive layers and phase change material unit layers, thermal conductivity in the horizontal direction may be dramatically improved. In addition, due to a high volume percentage of a phase change material, a heat spreader with a large heat capacity may be provided.
    Type: Application
    Filed: July 17, 2020
    Publication date: January 21, 2021
    Applicant: Industry-University Cooperation Foundation Hanyang University
    Inventors: Dong Rip KIM, Chang Sung HEU, Su Ho KIM, Heung Soo LEE, Hyeon Woo SON
  • Publication number: 20180104914
    Abstract: A porous structure according to one embodiment of the present invention is constituted by a frame having a plurality of pores interconnected 3-dimensionally through a plurality of connecting passages. The plurality of pores defined by the frame are distributed in a closest packed state and are interconnected 3-dimensionally through a plurality of connecting passages in a symmetric structure, thus being effective in achieving a maximum porosity of the porous structure. A porous hierarchical structure according to one embodiment of the present invention includes a first porous structure having a plurality of 3-dimensionally interconnected first pores and a second porous structure having a plurality of 3-dimensionally interconnected second pores whose diameter is different from that of the first pores and surrounding and bonded to the first porous structure.
    Type: Application
    Filed: May 4, 2016
    Publication date: April 19, 2018
    Applicants: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), INTELLIGENT SYNTHETIC BIOLOGY CENTER
    Inventors: Dong Rip KIM, Min Soo JEON, Jeong Hun HWANG, Sun Chang KIM, Byung Kwan CHO, Chang Sung HEU