Patents by Inventor Chang-Suo Ryu

Chang-Suo Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Post bump and method of forming the same
    Publication number: 20110012261
    Abstract: A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.
    Type: Application
    Filed: September 22, 2010
    Publication date: January 20, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS
    Inventors: Jin-Won Choi, Chang-Suo Ryu, Seung-Hyun Cho, Seung-Wan Kim