Patents by Inventor Chang Tien-Tsai
Chang Tien-Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9881892Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.Type: GrantFiled: January 23, 2017Date of Patent: January 30, 2018Assignee: Novatek Microelectronics Corp.Inventors: Jung-Fu Hsu, Tai-Hung Lin, Chang-Tien Tsai
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Publication number: 20170133343Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.Type: ApplicationFiled: January 23, 2017Publication date: May 11, 2017Applicant: Novatek Microelectronics Corp.Inventors: Jung-Fu Hsu, Tai-Hung Lin, Chang-Tien Tsai
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Patent number: 9627337Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.Type: GrantFiled: June 16, 2015Date of Patent: April 18, 2017Assignee: Novatek Microelectronics Corp.Inventors: Jung-Fu Hsu, Tai-Hung Lin, Chang-Tien Tsai
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Publication number: 20150287686Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.Type: ApplicationFiled: June 16, 2015Publication date: October 8, 2015Inventors: Jung-Fu Hsu, Tai-Hung Lin, Chang-Tien Tsai
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Publication number: 20150194399Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.Type: ApplicationFiled: March 24, 2015Publication date: July 9, 2015Inventors: Tai-Hung Lin, Chang-Tien Tsai
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Patent number: 9041201Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.Type: GrantFiled: October 25, 2013Date of Patent: May 26, 2015Assignee: Novatek Microelectronics Corp.Inventors: Tai-Hung Lin, Chang-Tien Tsai
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Publication number: 20140048935Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.Type: ApplicationFiled: October 25, 2013Publication date: February 20, 2014Applicant: Novatek Microelectronics Corp.Inventors: Tai-Hung Lin, Chang-Tien Tsai
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Patent number: 8618660Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead.Type: GrantFiled: March 18, 2012Date of Patent: December 31, 2013Assignee: Novatek Microelectronics Corp.Inventors: Tai-Hung Lin, Chang-Tien Tsai
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Publication number: 20120248606Abstract: An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead.Type: ApplicationFiled: March 18, 2012Publication date: October 4, 2012Applicant: NOVATEK MICROELECTRONICS CORP.Inventors: Tai-Hung Lin, Chang-Tien Tsai
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Patent number: 7649399Abstract: A signal generating and switching apparatus and a method thereof are provided. According to a simple layout technique, the signal switching apparatus is formed in each layer of a plurality of metal layers in an integrated circuit. When there is a need to correct any one of the plurality of conductive layers in the integrated circuit, the changing of the signal switching apparatus in that conductive layer can be achieved by changing mask patterns of the conductive layer. As a result, the transmission path of signals in the conductive layer is changed, and the purpose to change output logic signals is achieved. Therefore, there is no need to change additional conductive layers, thereby significantly reducing the correcting cost of the integrated circuit.Type: GrantFiled: May 23, 2007Date of Patent: January 19, 2010Assignee: Novatek Microelectronics Corp.Inventors: Chang-Tien Tsai, Cheng-Chung Shih, Shih-Pin Hsu
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Publication number: 20080054985Abstract: A signal generating and switching apparatus and a method thereof are provided. According to a simple layout technique, the signal switching apparatus is formed in each layer of a plurality of metal layers in an integrated circuit. When there is a need to correct any one of the plurality of conductive layers in the integrated circuit, the changing of the signal switching apparatus in that conductive layer can be achieved by changing mask patterns of the conductive layer. As a result, the transmission path of signals in the conductive layer is changed, and the purpose to change output logic signals is achieved. Therefore, there is no need to change additional conductive layers, thereby significantly reducing the correcting cost of the integrated circuit.Type: ApplicationFiled: May 23, 2007Publication date: March 6, 2008Applicant: NOVATEK MICROELECTRONICS CORP.Inventors: Chang-Tien Tsai, Cheng-Chung Shih, Shih-Pin Hsu
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Publication number: 20070149324Abstract: A golf tee includes a support member having a support post and a ball support portion extending from the support post, and a ball support removably mounted on the support member and having a mounting seat detachably mounted on the ball support portion of the support member and a plurality of support claws mounted on the mounting seat to support a golf ball. Thus, the golf tee has two different ways to support the golf ball according to the requirement of different users, thereby facilitating the user operating the golf tee, and thereby enhancing the versatility of the golf tee.Type: ApplicationFiled: December 28, 2005Publication date: June 28, 2007Inventor: Chang-Tien Tsai
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Patent number: 6397843Abstract: An electrical and manual pressing device of automatic air blowing for first-aid cardiopulmonary resuscitation comprises pressing unit, an air storage tank, a control chamber, air levels, and a sucking disk. The device has the following functions: filling the air by way of electrical actuation or manual pressing, offering a great deal of air, maintaining a constant pressing force against the heart, quickly fixing the sucking disk at a proper pressing position based on the size of the bust line, checking a breathing reaction of the patient by way of the air level, checking the heart beat by way of the stethoscope, offering oxygen or the fresh air after the heat beat restoring by way of the pumping ball.Type: GrantFiled: February 17, 2000Date of Patent: June 4, 2002Inventor: Chang Tien-Tsai