Abstract: The present disclosure according to at least one embodiment relates to, in the learning process of a child using smart toys, a method and system for providing an interactive service by using a smart toy, which provide more accurate classified emotional state of the child based on at least one or more sensed data items of an optical image, a thermal image, and voice data of the child, as well as adaptively provide a flexible and versatile interactive service according to classified emotions.

Abstract: The present disclosure according to at least one embodiment relates to, in the learning process of a child using smart toys, a method and system for providing an interactive service by using a smart toy, which provide more accurate classified emotional state of the child based on at least one or more sensed data items of an optical image, a thermal image, and voice data of the child, as well as adaptively provide a flexible and versatile interactive service according to classified emotions.

Abstract: Disclosed is a device for inspecting a bonded wafer using laser, which has a simple structure to facilitate an operation of the device and can detect an interface defect of the bonded wafer economically and highly reliably. To this end, the device for inspecting the bonded wafer using laser includes a laser unit, a laser diffusion unit, and a detection unit. If the device of inspecting the bonded wafer using laser according to the present invention is used, it is possible to advantageously inspect a wafer interface at a magnification desired by an inspector. In addition, the device has a simple structure, and thus it is advantageously easy to operate the device.

Abstract: Provided is a bonded wafer inspection method using a laser method allowing a simple and reliable test in an examination of a bonded wafer interface using a laser. To do this, a laser used bonded wafer inspection method includes, emitting a laser beam through a laser means, diffusing the emitted laser beam by a laser diffusion means, illuminating the diffused laser beam on a bonded wafer, and detecting a laser beam illuminated and transmitted at the bonded wafer using a detecting means. In a case a bonded wafer inspection method using a laser of the invention is used, defects by a foreign substance occurring at an interface of a bonded wafer is can be examined in a simple way and thus high work performance may be expected.