Abstract: A temperature control system for semiconductor manufacturing equipment is disclosed, which can properly cool a process chamber adopted in the semiconductor manufacturing equipment such as a wafer etching device. The temperature control system for semiconductor manufacturing equipment includes a thermocline for cooling heat transfer fluid accommodated therein through a heat exchange with a heat exchanger and storing heat energy, a supply line for controlling the temperature of the heat transfer fluid in the thermocline through a heater and supplying the heat transfer fluid with a proper temperature to a process device, a recovery line for forwarding the heat transfer fluid having passed through the process device to the thermocline, and a bypass for forwarding a part of the heat transfer fluid passing through the recovery line to the supply line through the heater.