Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layered substrate, and thermal interface material interposed between the signal lines and the heat sink to transfer heat from the multi-layered substrate to the heat sink. The heat sink thus dissipates the heat generating from the multi-layered substrate and along with the ground voltage plate suppresses electromagnetic interference of signal transmitted through adjacent ones of the signal lines. The thermal interface material also serves in the design phase as a means to tune the impedance of the signal lines.

Abstract: Embodiments are described in which a stacked arrangement of integrated circuit packages comprises a dummy substrate comprising an embedded discrete or distributed capacitor connected to first and/or second power voltages, or an embedded termination register connected to one or more clock, control, address, and/or data signals(s).

Abstract: A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board (PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.

Abstract: A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layered substrate, and thermal interface material interposed between the signal lines and the heat sink to transfer heat from the multi-layered substrate to the heat sink. The heat sink thus dissipates the heat generating from the multi-layered substrate and along with the ground voltage plate suppresses electromagnetic interference of signal transmitted through adjacent ones of the signal lines. The thermal interface material also serves in the design phase as a means to tune the impedance of the signal lines.

Abstract: Embodiments are described in which a stacked arrangement of integrated circuit packages comprises a dummy substrate comprising an embedded discrete or distributed capacitor connected to first and/or second power voltages, or an embedded termination register connected to one or more clock, control, address, and/or data signals(s).

Abstract: A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board(PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.