Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.

Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.

Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.

Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.

Abstract: Semiconductor manufacturing equipment is disclosed and comprises a robot comprising a robotic arm adapted to transfer a wafer from a wafer cassette in a load lock chamber to a processing chamber with proper alignment and positioning without the need to intermediately pass through a support chamber specially adapted to align and position the wafer.

Abstract: An optical microscope has an illuminator from which light emanates to illuminate an object under examination, and an auxiliary magnifying lens unit which magnifies an image of the object formed by the light reflecting from the object. A reflective cover is connected to the bottom of the ocular lens unit of the microscope. An auxiliary magnifying unit, made up of the auxiliary magnifying lens mounted in a casing, is disposed within the reflective cover adjacent the bottom of the ocular lens unit. The illuminator is located between the reflective cover and the casing of the auxiliary magnifying unit. The auxiliary magnifying lens is thus shielded from the illuminator. The light emitted from the illuminator is prevented from propagating directly to the auxiliary magnifying lens (along any straight line from the illuminator) or indirectly to the auxiliary magnifying lens via reflection from the inner wall of the reflective cover. Accordingly, a clear image of the object is produced.

Abstract: An X-Y table of a microscope includes an a X-axis moving plate, an object holder mounted on an upper surface of the X-axis moving plate, a Y-axis moving plate to which the X-axis moving plate is slidingly coupled for movement in the X direction, a fixed plate to which the Y-axis moving plate is slidingly coupled for movement in the Y direction, an X-axis driving system which uses a belt for moving the X-axis moving plate in the X direction, and Y-axis driving system which also uses a belt for moving the Y-axis moving plate in the Y direction. The X-axis moving plate and the Y-axis moving plate serve as the stage of the microscope. In operation, when it is desired to move the X- and Y-moving plates rapidly to generally position the object under the microscope, the belts of the X- and Y-driving systems are disengaged from drive elements associated therewith.