Abstract: The present disclosure relates to a heat dissipation hole structure of a flip-type electronic device. The heat dissipation hole structure includes a first connecting rod, a second connecting rod, and a blade group. The flip-type electronic device includes a base, an upper cover, and a pivot. Two ends of the first connecting rod are respectively pivoted to the pivot and the second connecting rod. The second connecting rod is further pivoted to the blade group. The blade group is disposed in an opening of the base and includes two blades. The two blades are both pivoted to an inner surface of the opening, and one end of each of the two blades is slidably connected to each other. In this way, when the upper cover is opened, the pivot drives the blade group through the first connecting rod and the second connecting rod, so that the two blades rotate.

Abstract: An electronic device includes a first body, a second body, and a palm component. One end of the first body comprises a supporting portion. The second body is pivotally connected to a first side of the supporting portion and comprises a sliding portion. The palm component is pivotally connected to a second side of the supporting portion and comprises a guiding portion. The sliding portion is movably connected to the guiding portion. When the first body is pivotally rotated and expended relative to the second body, the second body is driven to make the sliding portion move along the guiding portion, and the second side of the supporting portion rotates relative to the first end of the supporting portion to make the palm component protrude from the second body. A tilt angle is formed between the second body and the protruding palm component.

Abstract: An electronic device includes a first body, a second body, and a palm component. One end of the first body comprises a supporting portion. The second body is pivotally connected to a first side of the supporting portion and comprises a sliding portion. The palm component is pivotally connected to a second side of the supporting portion and comprises a guiding portion. The sliding portion is movably connected to the guiding portion. When the first body is pivotally rotated and expended relative to the second body, the second body is driven to make the sliding portion move along the guiding portion, and the second side of the supporting portion rotates relative to the first end of the supporting portion to make the palm component protrude from the second body. A tilt angle is formed between the second body and the protruding palm component.

Abstract: The present disclosure relates to a heat dissipation hole structure of a flip-type electronic device. The heat dissipation hole structure includes a first connecting rod, a second connecting rod, and a blade group. The flip-type electronic device includes a base, an upper cover, and a pivot. Two ends of the first connecting rod are respectively pivoted to the pivot and the second connecting rod. The second connecting rod is further pivoted to the blade group. The blade group is disposed in an opening of the base and includes two blades. The two blades are both pivoted to an inner surface of the opening, and one end of each of the two blades is slidably connected to each other. In this way, when the upper cover is opened, the pivot drives the blade group through the first connecting rod and the second connecting rod, so that the two blades rotate.