Abstract: An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.

Abstract: An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.

Abstract: An end seal device of a linear guide includes a main plate and a cladding member. The main plate includes an upper portion, two engaging portions extending downwardly and bent rearwardly from the upper portion, and two lower contact portions extending downwardly from the engaging portions and each having a penetrating hole. The cladding member includes cladding portions respectively attached to major surfaces of the main plate, and two filling portions each filling the penetrating hole to interconnect the cladding portions for firmly covering and protecting the main plate.