Patents by Inventor Chang-Yen Ko
Chang-Yen Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935789Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.Type: GrantFiled: September 6, 2022Date of Patent: March 19, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, J K Ho
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Patent number: 11699649Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.Type: GrantFiled: November 12, 2021Date of Patent: July 11, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, J K Ho
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Publication number: 20220415760Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.Type: ApplicationFiled: September 6, 2022Publication date: December 29, 2022Inventors: Chang-Yen Ko, JK Ho
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Patent number: 11538743Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.Type: GrantFiled: December 1, 2020Date of Patent: December 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, Jk Ho
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Patent number: 11444012Abstract: In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.Type: GrantFiled: March 26, 2020Date of Patent: September 13, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yuh-Harng Chien, Chang-Yen Ko, Chih-Chien Ho
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Patent number: 11437303Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.Type: GrantFiled: February 12, 2019Date of Patent: September 6, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, J K Ho
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Publication number: 20220068790Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.Type: ApplicationFiled: November 12, 2021Publication date: March 3, 2022Inventors: Chang-Yen Ko, JK Ho
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Patent number: 11183450Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.Type: GrantFiled: June 3, 2020Date of Patent: November 23, 2021Assignee: Texas Instruments IncorporatedInventors: Chang-Yen Ko, J K Ho
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Publication number: 20210305139Abstract: In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.Type: ApplicationFiled: March 26, 2020Publication date: September 30, 2021Inventors: Yuh-Harng Chien, Chang-Yen Ko, Chih-Chien Ho
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Publication number: 20210082794Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.Type: ApplicationFiled: December 1, 2020Publication date: March 18, 2021Inventors: Chang-Yen Ko, JK Ho
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Patent number: 10854538Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.Type: GrantFiled: February 12, 2019Date of Patent: December 1, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, JK Ho
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Publication number: 20200294906Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.Type: ApplicationFiled: June 3, 2020Publication date: September 17, 2020Inventors: Chang-Yen Ko, JK Ho
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Publication number: 20200258819Abstract: A microelectronic device has a substrate attached to a substrate pad on a first face of the substrate, and a component attached to the substrate on the first face. The substrate has a component placement guide on the first face. The substrate has a singulation guide on a second face of the substrate, located opposite from the first face. The microelectronic device is formed by attaching the component to a substrate sheet which contains the substrate. The substrate sheet with the component is mounted on a singulation film so that the component contacts the singulation film. The singulation guide on the second face of the substrate is located opposite from the singulation film. The substrate is singulated from the substrate sheet. The substrate with the component is attached to the substrate pad on the first face of the substrate, adjacent to the component.Type: ApplicationFiled: February 12, 2019Publication date: August 13, 2020Applicant: Texas Instruments IncorporatedInventors: Chang-Yen Ko, JK Ho
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Publication number: 20200258820Abstract: A microelectronic device has a first die attached to a first die pad, and a second die attached to a second die pad. A magnetically permeable member is attached to a first coupler pad and a second coupler pad. A coupler component is attached to the magnetically permeable member. The first die pad, the second die pad, the first coupler pad, the second coupler pad, and the magnetically permeable member are electrically conductive. The first coupler pad is electrically isolated from the first die, from the second coupler pad, and from external leads of the microelectronic device. The second coupler pad is electrically isolated from the first die and from the external leads. The first die and the second die are electrically coupled to the coupler component. A package structure contains at least portions of the components of the microelectronic device and extends to the external leads.Type: ApplicationFiled: February 12, 2019Publication date: August 13, 2020Applicant: Texas Instruments IncorporatedInventors: Chang-Yen Ko, JK Ho
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Patent number: 10714418Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.Type: GrantFiled: September 20, 2018Date of Patent: July 14, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, J K Ho
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Publication number: 20200211934Abstract: A leadframe for a multichip semiconductor package includes a first die pad and at least a second die pad both vertically offset at least 0.2 mm relative to leads or lead terminals that are positioned on at least 2 sides beyond the first die pad and the second die pad. At least one of the first and second die pads has a reduced thickness portion and a full thickness portion, and wherein the full thickness portion has a same thickness as a thickness of at least an outside portion the leads or the lead terminals.Type: ApplicationFiled: December 31, 2018Publication date: July 2, 2020Inventor: CHANG-YEN KO
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Publication number: 20200118899Abstract: A semiconductor isolation package includes a leadframe that includes a plurality of leadframe leads. At least one of the plurality of leadframe leads includes a lead body having a first end that comprises an external pin portion and a second end. The lead body has a leg portion coupled to a central lead portion that is coupled to an edge bend portion. The edge bend portion is formed by a first bend on the lead body proximate the second end between the central lead portion and edge bend portion. The first bend is in the direction of the first end on the leg portion. The edge bend assists in shielding electronic fields. Other aspects are presented.Type: ApplicationFiled: December 10, 2019Publication date: April 16, 2020Inventors: John Paul Tellkamp, Chang-Yen Ko
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Publication number: 20190385899Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.Type: ApplicationFiled: August 26, 2019Publication date: December 19, 2019Inventors: Chang-Yen Ko, Chung-Ming Cheng, Megan Chang, Chih-Chien HO
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Publication number: 20190295939Abstract: An electronic device (e.g., integrated circuit) and method of making the electronic device is provided that reduces a strength of an electric field generated outside a package of the electronic device proximate to the low voltage lead pins. The electronic device includes a low voltage side and a high voltage side. The low voltage side includes a low voltage die attached to a low voltage die attach pad. Similarly, the high voltage side includes a high voltage die attached to a high voltage die attach pad. Lead pins are attached to each of the low and high voltage attach pads and extend out from a package of the electronic device in an inverted direction.Type: ApplicationFiled: September 20, 2018Publication date: September 26, 2019Inventors: CHANG-YEN KO, JK HO
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Patent number: 10395971Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.Type: GrantFiled: December 22, 2017Date of Patent: August 27, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, Chung-Ming Cheng, Megan Chang, Chih-Chien Ho