Abstract: The present invention relates to a surface-treated copper foil, which has excellent adhesive strength with a resin substrate, shows low bending deformation after adhesion with a resin substrate, and is suitable as a high-frequency foil due to its low transmission loss, to a copper clad laminate comprising same, and to a printed wiring board.

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 ?m to about 0.5 ?m and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

Abstract: Disclosed herein are a surface-treated copper foil for a negative electrode current collector for secondary batteries, a method for producing the same, and a negative electrode for secondary batteries including the same. The surface-treated copper foil includes needle-shaped copper particles formed on at least one surface thereof, wherein the copper particles have an average major-axis length of about 0.6 ?m to about 2.0 ?m and are separated from one another by a distance of about 1 ?m to about 5 ?m.

Abstract: Provided is an electrolytic nickel foil including, on at least one surface thereof, a flat surface having the following surface roughness: a Ra of 0.05 ?m or less, a Rz of 0.2 ?m or less, and a Rt of 0.5 ?m or less and a glossiness of 200 GU or more as determined by measuring a 60° specular reflection angle.

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 ?m to about 0.5 ?m and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

Abstract: Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.

Abstract: Provided is an ultra-thin copper foil to which a carrier foil is attached, including: a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer includes a first metal A having peelability, a second metal B and a third metal C facilitating coating of the first metal, wherein the amount (a) of the first metal A is in a range of about 30 to about 89% by total weight of the peeling layer, the amount (b) of the second metal B is in a range of about 10 to about 60% by total weight of the peeling layer, and the amount (c) of the third metal C is in a range of about 1 to about 20% by total weight of the peeling layer.