Abstract: A,method and an apparatus for cleaning semiconductor devices, in which water droplets are completely eliminated after the wafer is cleaned in the course of the semiconductor manufacturing process. In the method and apparatus, after the thin film is cleaned, a cut off valve cuts off the supply of cleaning solution to a cleaning container. At the same time, a first drain valve, second drain valve, and third drain valve respectively open a first drain path, a second drain path, and third drain path in serial order, with a predetermined time interval between each stage, thereby slowly draining the cleaning solution from the container. The cleaning solution is easily and nearly completely separated from the wafer due to the surface tension of the cleaning solution, and no large drops of the cleaning solution are left on the wafer.

Abstract: A method and an apparatus for cleaning semiconductor devices, in which water droplets are completely eliminated after the wafer is cleaned in the course of the semiconductor manufacturing process. In the method and apparatus, after the thin film is cleaned, a cut off valve cuts off the supply of cleaning solution to a cleaning container. At the same time, a first drain valve, second drain valve, and third drain valve respectively open a first drain path, a second drain path, and third drain path in serial order, with a predetermined time interval between each stage, thereby slowly draining the cleaning solution from the container. The cleaning solution is easily and nearly completely separated from the wafer due to the surface tension of the cleaning solution, and no large drops of the cleaning solution are left on the wafer.

Abstract: A semiconductor wafer cleaning apparatus is provided with a bracket having an improved housing structure. The housing is provided to support a sensor that can stablely detect when wafers are placed in each cleaning bath. The sensor is generally in two parts, a photodiode for emitting a beam of light, and a photodetector for detecting the beam of light. A sensor supporting member receives the sensor and includes a cover, one or more side walls, a bottom part, and a plurality of projections formed on the bottom part. The bottom part has a through-hole and is spaced from an outer surface of the process vessel to form a first space between the bottom part and the process vessel. The plurality or are spaced to form a second space between the sensor and the bottom part of the sensor supporting member. A gas introducing section introduces a water vapor eliminating gas into the second space. The gas introduced into the second space flows through the through-hole into the first space.