Patents by Inventor Chang-Young Sohn

Chang-Young Sohn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11679627
    Abstract: A non-pneumatic tire having a block type reinforcement configuration includes: a tread unit that forms an outer portion of the tire and comes in contact with a road surface; a wheel unit that is connected to an axle; a spoke unit that is formed between the tread unit and the wheel unit; and a block type reinforcement unit that includes a block formed inside the tread unit in the circumferential direction of the tread unit, and a plurality of reinforcing members formed in the block to correspond to the shape of the block.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: June 20, 2023
    Assignee: HANKOOK TIRE & TECHNOLOGY CO., LTD
    Inventors: Jeong Mu Heo, Chang Young Sohn, Seok Ju Choi
  • Publication number: 20200324576
    Abstract: A non-pneumatic tire having a block type reinforcement configuration includes: a tread unit that forms an outer portion of the tire and comes in contact with a road surface; a wheel unit that is connected to an axle; a spoke unit that is formed between the tread unit and the wheel unit; and a block type reinforcement unit that includes a block formed inside the tread unit in the circumferential direction of the tread unit, and a plurality of reinforcing members formed in the block to correspond to the shape of the block.
    Type: Application
    Filed: November 6, 2019
    Publication date: October 15, 2020
    Inventors: Jeong Mu HEO, Chang Young SOHN, Seok Ju CHOI
  • Patent number: 7087462
    Abstract: The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, adhering a die to the die pad, forming a plurality of conductive wires to electrically connect bond pads of the die with bond regions of the leads, forming an encapsulation covering the leadframe, forming a patterned photoresist layer on a lower surface of the leadframe to expose a plurality of interval regions and the outer dambars, performing an etching process to expose the metal layer located in the interval regions and the outer dambars, cutting off the metal layer located in the interval regions by a half cutting process, and performing a singulation process to singulate the units.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: August 8, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Sang-Bae Park, Yong-Gill Lee, Hyung-Jun Park, Chang-Young Sohn