Abstract: A circuit board assembly mechanism for assembling a first circuit board in suspension in the circuit board assembly mechanism includes a base and connecting bracket. The base has a pillar extruding from a bottom plate of the base and a side plate bending from a wing of the bottom plate. The pillar is positioned corresponding to a first hole of first circuit board and houses it atop by inserting a fixer through the first hole into the pillar. The connecting bracket has a first end and a second end in opposition to each other for connecting the first circuit board with the side plate of the base by fixing the first end on the first circuit board and restricting the second end on the side plate, thereby assembling the first plate in suspension within the base by the pillar and the connecting bracket and reserving the space between the first circuit board and the bottom plate for assembling a second circuit board.

Abstract: A method for forming a semiconductor device and a device made using the method are provided. In one example, the method includes forming a hard mask layer on a semiconductor substrate and patterning the hard mask layer to form multiple openings. The substrate is etched through the openings to form forming a plurality of trenches separating multiple semiconductor mesas. The trenches are partially filled with a dielectric material. The hard mask layer is removed and multiple-gate features are formed, with each multiple-gate feature being in contact with a top surface and sidewalls of at least one of the semiconductor mesas.