Abstract: A transistor structure includes a substrate, a source electrode, a drain electrode, a protective layer and a gate electrode. The source electrode and the drain electrode are provided on the substrate. The protective layer is provided on the substrate. The protective layer is provided between the source electrode and the drain electrode. The protective layer includes a SiNx layer and a SiOx layer. The SiOx layer is provided on the substrate, the SiNx layer is provided on the SiOx layer, and a through hole of the protective layer is formed to extend through the SiNx layer and the SiOx layer. The gate electrode is provided in the through hole, and the gate electrode is separated from at least part of the SiOx layer so as to form an air gap therebetween.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: An electric curtain includes an upper beam, two curtain ropes, a curtain body and a lower beam. The upper beam includes a rotating shaft, a pivotal member, two rope winders, a controller and a wireless control unit installed inside the controller. The wireless control unit has the technical feature of receiving and matching with a wireless transmission communication protocol originated from the external, thereby allowing the electric curtain to achieve the effect of establishing the most optimal electrical conduction and wireless communication transmission between the two based on the external wireless transmission communication protocol selected and matched.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: A training method for a neural network includes determining first disassembly paths of a plurality of first molecules, and obtaining a first cost dictionary based on the first disassembly paths of the first molecules. The method also includes determining molecular expression information of second molecules based on the first disassembly paths of the first molecules, and determining a plurality of third molecules from the second molecules, each of the third molecules representing a class of the second molecules. The method further includes obtaining a second cost dictionary based on second disassembly paths of the third molecules, and performing training based on the first cost dictionary and the second cost dictionary to obtain a target neural network. The target neural network being configured to output cost value information corresponding to a target molecule according to input molecular expression information of the target molecule.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: A computer device and a method for converting a working mode of a universal serial bus (USB) connector of the computer device. The computer device comprises a USB connector, a power interruption unit, a first switch unit, a south bridge chip, a reading unit, a control unit, and a charging control unit. The USB connector is linked to an external USB device. When a fast charging instruction is received, the power interruption unit interrupts the power supply of the USB connector; the first switch unit performs switching, so that the USB connector works in a fast charging mode. When the control unit receives a common charging instruction, the power interruption unit interrupts the power supply of the USB connector; the first switch unit performs switching, so that the USB connector works in a common charging mode, and data transmission can be performed.

Abstract: A computer device and a method for converting a working mode of a universal serial bus (USB) connector of the computer device. The computer device comprises a USB connector, a power interruption unit, a first switch unit, a south bridge chip, a reading unit, a control unit, and a charging control unit. The USB connector is linked to an external USB device. When a fast charging instruction is received, the power interruption unit interrupts the power supply of the USB connector; the first switch unit performs switching, so that the USB connector works in a fast charging mode. When the control unit receives a common charging instruction, the power interruption unit interrupts the power supply of the USB connector; the first switch unit performs switching, so that the USB connector works in a common charging mode, and data transmission can be performed.

Abstract: A transmission interface system includes a connector; a detecting unit, a control unit, a chipset and a resetting unit. The connector includes lots of transmission interfaces. The detecting unit detects the data type of the current transmitting data and outputs a detecting signal; the control unit receives the detecting signal and informs the resetting unit to output a resetting signal to the chipset. The chipset is reset after receiving the resetting signal, and then the control unit informs the chipset to output a data signal corresponding to the data type of the current transmitting data to the connector.

Abstract: A control circuit of universal serial bus (USB) port includes a charge control unit providing a first operating voltage and a second operating voltage to a first operating voltage end and a second operating voltage end of the USB port, and a first circuit unit coupled to the charge control unit. Furthermore, the first circuit includes a first output end and a second output end. When a external apparatus is inserted into the USB port, the charge control unit connects the first output end and the second output end to a differential positive end and a differential negative end of the USB port, respectively, to enter a rapid charging mode.

Abstract: A module cover is equipped with at least one door latch transmission mechanism for closing the entrance of a wafer transport module, each door latch transmission mechanism includes a door latch supported on a roller at the module cover, a latch bolt pivotally coupled between one end of the door latch and a part of the module cover, and a driving wheel coupled to the module cover and rotated to move the door latch forwards and backwards and to further turn the latch bolt in and out of a through hole on the module cover and a respective latch hole on the wafer transport module to lock/unlock the module cover.

Abstract: A module cover is equipped with at least one door latch transmission mechanism for closing the entrance of a wafer transport module, each door latch transmission mechanism includes a door latch supported on a roller at the module cover, a latch bolt pivotally coupled between one end of the door latch and a part of the module cover, and a driving wheel coupled to the module cover and rotated to move the door latch forwards and backwards and to further turn the latch bolt in and out of a through hole on the module cover and a respective latch hole on the wafer transport module to lock/unlock the module cover.